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Generel CharacteristicsGenerel Characteristics: 
DesignerCompany which designed the semiconductor component Qualcomm
Type Snapdragon 820 MSM8996
Year Released 2015
FunctionMain function of the component  Multi-core Application Processor with Modem

ArchitectureArchitecture: 
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 64 bit
Supported Instruction Set(s) ARMv8-A (A32, A64)
Number of processor core(s) 4
Type of processor core(s)Type and allocation of processor core(s) 4x Qualcomm Kryo

BusesBuses: 
Memory Interface(s):   mobile (LP) DDR4 SDRAM
Max. Clock Frequency of Memory IFClock frequency of fastest supported memory interface 1866 MHz
Data Bus WidthMaximum selectable bit width of primary data bus (RAM) of memory interface 32 bit
Number of data bus channels 2 ch
Max. Data RateMaximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. 29.86 Gbyte/s
Non-volatile Memory Data Bus WidthMaximum selectable bit width of secondary data (non-volatile storage) bus of memory interface 16 bit
Non-volatile Memory InterfaceInterface which determines physical layer towards the NV memory  eMMC 5.1Complies with embedded MMC 5.1 specification released in 2015 , UFS 2.0UFS revision 2.0 (released in 2013) defines single-lane 600 MB/s or dual-lane 1.2 GB/s NAND flash EEPROM interface


Clock FrequenciesClock Frequencies: 
Recommended Minimum Clock Frequency 1593 MHz min.
Recommended Maximum Clock Frequency 2150 MHz max.

Cache MemoriesCache Memories: 
L1 Instruction Cache per CoreCapacity of level 1 instruction cache per processor core 32 Kbyte I-Cache
L1 Data Cache per CoreCapacity of level 1 data cache per processor core 32 Kbyte D-Cache
Total L2 CacheCapacity of level 2 cache shared between processor core(s) 1536 Kbyte L2

Technology and PackagingTechnology and Packaging: 
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 14 nm
Semiconductor Technology:   CMOSComplementary Metal-oxide - Semiconductor Field Effect Transistor
FabPlant which fabricates the semiconductor component TSMC

Graphical SubsystemGraphical Subsystem: 
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). Qualcomm Adreno 530 GPU
GPU Clock 624 MHz GPU
Dedicated Graphics MemoryDedicated operative memory (video RAM, VRAM) 1 MiB

Cellular CommunicationCellular Communication: 
Supported Cellular Data LinksList of supported cellular data links  CSD 9.6 kbpsCircuit Switched Data (CSD) is the original data link protocol of GSM. Up to 9600bit/s download speed , GPRS (Class unspecified)General Packet Radio Service , EDGE (Class unspecified)Enhanced Data Rates for GSM Evolution also known as Enhanced GPRS (EGPRS) , UMTS 384 kbps (W-CDMA)Universal Mobile Telecommunications System. UMTS Release '99 data link layer, W-CDMA grants up to 384 kbit/s pocket-switched download speed. , HSUPA (Cat. unspecified)High-Speed Uplink Packet Access is a 3.5G UMTS uplink protocol. , HSUPA 5.76 Mbps (Cat. 6) , HSUPA 11.5 Mbps (Cat. 7) , HSDPA (Cat. unspecified)High-Speed Downlink Packet Access is a 3.5G UMTS downlink protocol. , HSPA+ 21.1 Mbps (Cat. 18) , DC-HSDPA 42.2 Mbps (Cat. 24)Dual-carrier HSPA+ 42.2 Mbps , cdmaOne (IS-95) , CDMA2000 1xRTT (IS-2000) , CDMA2000 1xEV-DO Rel. 0 , CDMA2000 1xEV-DO Revision A , CDMA2000 1xEV-DO Revision B , TD-SCDMATime Division Synchronous Code Division Multiple Access is the implementation of UMTS  (3G) cellular network in China. , LTE (Cat. unspecified)LTE (Long Term Evolution) or the E-UTRAN (Evolved Universal Terrestrial Access Network), introduced in 3GPP R8, is the 4G access part of the Evolved Packet System (EPS). , LTE 100 Mbps / 50 Mbps (Cat. 3)LTE 100.8 Mbps / 50.4 Mbps (Cat. 3) , LTE 150 Mbps / 50 Mbps (Cat. 4)LTE 151.2 Mbps / 50.4 Mbps (Cat. 4) , LTE 300 Mbps / 50 Mbps (Cat. 6)More exact values: LTE 301.5 Mbps / 50.4 Mbps (Cat. 6) , LTE 450 Mbps / 100 Mbps (LTE Cat. 10)LTE Category 10: 452.2 Mbps downlink, 102 Mbps uplink data links

Communication InterfacesCommunication Interfaces: 
Supported USB Specification:   No
Bluetooth supportThis field specifies the supported BT version  No
Wireless LAN supportThis field enumerates the supported Wi-Fi protocols  No
Supported Audio/Video Interface:   No

Satellite NavigationSatellite Navigation: 
Supported GPS protocol(s):   Yes
Supported GLONASS protocol(s)GLONASS is a global satellite  navigation system operated by Russia.  Yes

Additional InformationAdditional Information: 
Special Features
dual Qualcomm Kryo Harvard Superscalar cores (up to 2.15 GHz) + dual Qualcomm Kryo Harvard Superscalar cores (up to 1.59 GHz), HMP, Hexagon 680 DSP, Qualcomm X12 LTE Modem, CDMA 2000 1x Adv./DO Rel 0., Rev. A/B, SVDO-DB, GSM, GPRS, EDGE, UMTS, DC-HSPA+ 42 Mbps, DC-HSUPA, LTE FDD/TDD Cat. 10, SVLTE-DB, Rel9 DC-HSPA+, TD-SCDMA baseband modem, LTE Advanced CA (up to 600 Mbps / 150 Mbps), dual SIM / dual active standby support (DSDA), display support, 2160p 60 fps video decode, 2160p 30 fps video encode, Qualcomm IZat GPS+Glonass, Bluetooth 4.1, OpenCL 1.2, OpenGL ES 3.1+, DirectX 11.1, Qualcomm VIVE 802.11ac/802.11ad, USB 3.0, Renderscript Compute, FlexRender support, Qualcomm Spectra 14-bit dual Image Signal Processors, 25 MP camera support, HDMI 2.0, USB 3.0 Qualcomm Quick Charge 3.0

Datasheet AttributesDatasheet Attributes: 

Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Preliminary
AddedThe exact time of the datasheet addition 2015-06-29 10:53
 
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