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Generel CharacteristicsGenerel Characteristics: 
DesignerCompany which designed the semiconductor component Qualcomm
Type Snapdragon S4 Prime MPQ8064
Year Released 2013
FunctionMain function of the component  Multi-core Application Processor

ArchitectureArchitecture: 
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 32 bit
Supported Instruction Set(s) ARMv7
Pipeline StagesPipeline is kind of instruction level parallelism where stages (FETCH, DEC, OP, EXEC, RES, etc.) of instruction execution are separeted and parallelized between neighboring instructions. 11 pipeline stages
Number of processor core(s) 4
Type of processor core(s)Type and allocation of processor core(s) 4x Qualcomm Krait

BusesBuses: 
Memory Interface(s):   mobile (LP) DDR2 SDRAM
Max. Clock Frequency of Memory IFClock frequency of fastest supported memory interface 533 MHz
Data Bus WidthMaximum selectable bit width of primary data bus (RAM) of memory interface 32 bit
Number of data bus channels 2 ch
Max. Data RateMaximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. 8.53 Gbyte/s
Non-volatile Memory InterfaceInterface which determines physical layer towards the NV memory  Yes


Clock FrequenciesClock Frequencies: 
Recommended Maximum Clock Frequency 1700 MHz max.

Cache MemoriesCache Memories: 
L0 Instruction Cache per CoreCapacity of level 0 instruction cache per processor core 4 Kbyte L0 I-Cache
L1 Instruction Cache per CoreCapacity of level 1 instruction cache per processor core 16 Kbyte I-Cache
Number of L1 Cache Ways:  4-way
L1 Data Cache per CoreCapacity of level 1 data cache per processor core 16 Kbyte D-Cache
Total L2 CacheCapacity of level 2 cache shared between processor core(s) 2048 Kbyte L2
Number of L2 Cache Ways:  8-way

Technology and PackagingTechnology and Packaging: 
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 28 nm
Semiconductor Technology:   CMOSComplementary Metal-oxide - Semiconductor Field Effect Transistor
FabPlant which fabricates the semiconductor component TSMC

Graphical SubsystemGraphical Subsystem: 
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). Qualcomm Adreno 320 GPU

Cellular CommunicationCellular Communication: 
Supported Cellular Data LinksList of supported cellular data links  No

Communication InterfacesCommunication Interfaces: 
Supported USB Specification:   No
Bluetooth supportThis field specifies the supported BT version  No
Wireless LAN supportThis field enumerates the supported Wi-Fi protocols  No
Supported Audio/Video Interface:   No

Satellite NavigationSatellite Navigation: 
Supported GPS protocol(s):   Yes
Supported GLONASS protocol(s)GLONASS is a global satellite  navigation system operated by Russia.  Yes

Additional InformationAdditional Information: 
Special Features
4x Qualcomm Krait Harvard Superscalar processor core, 2048x1536 display support (QXGA), 20 MP camera support, 1080p video encode/decode, gpsOneGen 8A with GLONASS, OpenGL ES 3.0, OpenCL 1.1, OpenVG 1.1, EGL 3.1, DirectX 11

Datasheet AttributesDatasheet Attributes: 

Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Preliminary
AddedThe exact time of the datasheet addition 2012-12-14 21:24
 
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