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Generel CharacteristicsGenerel Characteristics: 
DesignerCompany which designed the semiconductor component Texas Instruments
Type OMAP 5430
Year Released 2012
FunctionMain function of the component  Multi-core Application Processor

ArchitectureArchitecture: 
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 32 bit
Supported Instruction Set(s) ARMv7
Number of processor core(s) 2
Type of processor core(s)Type and allocation of processor core(s) 2x ARM Cortex-A15 MPcore + 2x ARM Cortex-M4

BusesBuses: 
Memory Interface(s):   mobile (LP) DDR2 SDRAM
Max. Clock Frequency of Memory IFClock frequency of fastest supported memory interface 533 MHz
Number of data bus channels 2 ch
Non-volatile Memory InterfaceInterface which determines physical layer towards the NV memory  Yes


Clock FrequenciesClock Frequencies: 
Recommended Maximum Clock Frequency 2000 MHz max.

Cache MemoriesCache Memories: 

Technology and PackagingTechnology and Packaging: 
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 28 nm
Semiconductor Technology:   CMOSComplementary Metal-oxide - Semiconductor Field Effect Transistor
FabPlant which fabricates the semiconductor component Texas Instruments
PinsNumber of pins on the package 980 pins

Graphical SubsystemGraphical Subsystem: 
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). IMG PowerVR SGX544 GPU

Cellular CommunicationCellular Communication: 
Supported Cellular Data LinksList of supported cellular data links  No

Communication InterfacesCommunication Interfaces: 
Supported USB Specification:   No
Bluetooth supportThis field specifies the supported BT version  No
Wireless LAN supportThis field enumerates the supported Wi-Fi protocols  No
Supported Audio/Video Interface:   No

Satellite NavigationSatellite Navigation: 
Supported GPS protocol(s):   No

Additional InformationAdditional Information: 
Special Features
2x ARM Cortex-A15 Harvard Superscalar processor core, 2x ARM Cortex-M4 Harvard companion processor core, Image signal processor (24 MP / 12 MP 3D camera support) , TI mini-C64x DSP, 2D/3D graphics acceleration (IVA-HD), PowerVR SGX SGX544-MPx GPU, SmartReflex 3, M-shield, ARM TrustZone, ARM NEON, HDMI 1.4a, 1080p60 video encode/decode, 1080p30 stereoscopic 3D video encode/decode, USB 3.0 OTG

Datasheet AttributesDatasheet Attributes: 

Related Page URL
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Preliminary
AddedThe exact time of the datasheet addition 2012-03-01 11:03
 
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