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IntroductionIntroduction: 
BrandBrand name of the device. This may match with the manufacturer Qualcomm
ModelOne or more (separated by /) specific model name identifies this device. This field often includes Model Code too which can be separated 810 Smartphone MDP
ReleasedFirst official market release date in (year, month) 2014 Dec
Hardware DesignerThe company which designed this device Intrinsyc Technologies
ManufacturerThe company which produces this device Intrinsyc Technologies
Device CategorySmartphone, tablet, smart watch, PDA, palmtop, etc.  SmartphoneCallular voice-capable usually touchscreen mobile computer which natively runs third-party apps.

Physical AttributesPhysical Attributes: 
DepthDepth refers to the thickness of the device. Depth is usually the smallest dimension of the device N/A

Software EnvironmentSoftware Environment: 
PlatformThe family of the operating system like Android, iOS, Windows Phone/Mobile, Palm OS, etc.  Android
Operating SystemPre-installed (usually embedded) operating system which the device was released with. Google Android 4.4.4 (KitKat)Google Android 4.4.4 (KitKat)

Application processor, ChipsetApplication processor, Chipset: 
CPU ClockFrequency of the square signal which schedules the internal operation of microprocessor (synchronous sequential logic). The current consumed by the processor is approximately proportional to clock rate. 2500 MHz
CPUManufacturer part number and most important characteristics of the IC which includes the main application processor or processors Qualcomm Snapdragon 810 MSM8994 v2.0, 2015, 64 bit, octa-core, 4096 Kbyte L2, 20 nm, Qualcomm Adreno 430 GPUQualcomm Snapdragon 810 MSM8994 v2.0, 2015, 64 bit, octa-core, 4096 Kbyte L2, 20 nm, Qualcomm Adreno 430 GPU

Operative MemoryOperative Memory: 
RAM TypeType of volatile memory IC which specifies RAM architecture, timing characteristics, refresh mode, voltage levels and physical design of the IC. Two major types of random-access memory is static RAM (SRAM) periodically refreshed dynamic RAM (DRAM).  LPDDR4 SDRAM
800 MHzClock frequency of the RAM databus (not necessarily equivalent to data transfer frequency). The width of the databus (e.g. 64 bit), RAM type (e.g. DDR SDRAM), number of channels and clock rate (e.g. 200 MHz) determines peak transfer rate
RAM Capacity (converted)RAM capacity in binary bytes (KiB: 1024 bytes, MiB: 1024 KiB, GiB: 1024 MiB) 4 GiB RAM

Non-volatile MemoryNon-volatile Memory: 
Non-volatile Memory InterfaceInterface (e.g. UFS 2.0, eMMC 5.1, moviNAND) which determines physical layer (width, clock rate, lanes, protocol) of data transfer between the application processor and the NV memory  Yes
Non-volatile Memory Capacity (converted)The value of ROM capacity converted to the most appropriate units (KiB: 1024 bytes, KB: 1000 bytes, MiB: 1024 KiB, MB: 1000 KB, GiB: 1024 MiB, GB: 1000 MB) 32 GB ROM

DisplayDisplayAll parameters that related to display
Display DiagonalThe distance measured between the furthest corners of the display. In case of display with rounded edges this refers to the diagonal of the smallest bounding rectangle. 156.7 mm
6.2 inchDisplay Diagonal in inches
ResolutionHorizontal and vertical resolution of the primary display. In case of display with rounded edges this refers to the smallest bounding rectangle. 1600x2560
Pixel DensityIndicates the number of pixels per inch 489 PPI
Display TypeDisplay technology, e.g. Color/ monochrome e-ink, STN, PM-OLED, AM-OLED, TN-TFT, IPS TFT, ASV TFT, MVA TFT, PVA TFT, PLS TFT  Color TN-TFT LCDColor TN-TFT (Twisted Nematic - Thin Film Transistor). This is an active matrix LCD technology. display
Number of Display ScalesMaximal number of displayable colors or scales 16.8M
Scratch Resistant ScreenUsual types: Gorilla Glass generations, DragonTrail/X, Sapphire Glass  No

Graphical SubsystemGraphical Subsystem: 
Graphical ControllerManufacturer and part number of the graphics controller IC or commercial name of the intellectual property (IP) if the graphics controller is the part of a chipset Qualcomm Adreno 430
Dedicated Graphics MemoryDedicated operative memory (video RAM, VRAM) of graphics controller or GPU which independent from the op. memory of the main processor. Graphics controller may have access to the main RAM (shared RAM) too 1.5 MiB

Audio/Video InterfacesAudio/Video Interfaces: 
A/V OutAudio/Video outputs form a heterogeneous group of interfaces that allow the user to connect the device to various external analog/digital multimedia devices (monitors, projectors, HD TVs) and play multimedia content. For example: MHL, DisplayPort, HDMI, e  HDMI 1.4HDMI 1.4 specification was published May 28, 2009 and introduces HDMI Type D micro connector and 4K video support.
HDMI D MicroFrom 2009Physical interface of the A/V out port. For example: HDMI D, USB-C, micro-USB or DB25

Audio SubsystemAudio Subsystem: 
Microphone(s)Analog or digital sound receiver. Main applications: voice calls, active noise cancellation, voice command, voice/video recording, voice identification  98.1
Loudspeaker(s):   mono
Audio Output:   3.5mm

Cellular PhoneCellular Phone: 
Supported Cellular BandsList of supported cellular networks with band names. For example GSM900 refers to the GSM system with the 890-915 MHz uplink and 935-960 downlink bands.  GSM850GSM850 phones support GSM 850 MHz (B5) band (downlink: 869.2 MHz - 894.2 MHz, uplink: 824.2 MHz - 849.2 MHz) , GSM900GSM900 phones support P-GSM (Primary GSM) 900 MHz (B8) band (downlink: 935.0 MHz - 960.0 MHz, uplink: 890.0 MHz - 915.0 MHz) and may support E-GSM (Extended GSM) 900 MHz band (downlink: 925.0 MHz - 960.0 MHz, uplink: 880.0 MHz- 915.0 MHz. , GSM1800GSM1800 phones support GSM / DCS / PCS 1800 MHz (B3) band (downlink: 1805.2 - 1879.8 MHz, uplink: 1710.2 - 1784.8 MHz). , GSM1900GSM1900 phones support PCS 1900 MHz (B2) band (downlink: 1930.2 - 1989.8 MHz, uplink: 1850.2 - 1909.8 MHz) , UMTS2100 (B1)UMTS2100 phones support UMTS 1900 / 2100MHz (IMT, also refferred as UMTS Band I) band (downlink: 2112.4 - 2167.6 MHz, uplink: 1922.4-1977.6 MHz) , UMTS1900 (B2)UMTS1900 phones support UMTS 1900MHz (PCS, also refferred as UMTS Band II) band (downlink: 1932.4 - 1987.6 MHz, uplink: 1852.4-1907.6 MHz) , UMTS850 (B5)UMTS850 phones support UMTS 850 MHz (CLR, also refferred as UMTS Band V) band (downlink: 871.4 - 891.6 MHz, uplink: 826.4 - 846.6 MHz) , UMTS900 (B8)UMTS900 phones support UMTS 900 MHz (UMTS Band VIII) band (downlink: 927.4 - 957.6 MHz, uplink: 882.4-912.6 MHz) bands
Supported Cellular Data LinksList of supported cellular data links and rates.  GPRSGeneral Packet Radio Service , EDGEEnhanced Data Rates for GSM Evolution also known as Enhanced GPRS (EGPRS) , UMTSUniversal Mobile Telecommunications System. UMTS Release '99 data link layer, W-CDMA grants up to 384 kbit/s pocket-switched download speed. , HSUPAHigh-Speed Uplink Packet Access is a 3.5G UMTS uplink protocol. , HSDPAHigh-Speed Downlink Packet Access is a 3.5G UMTS downlink protocol. , HSPA+ 21.1 , LTELTE (Long Term Evolution) or the E-UTRAN (Evolved Universal Terrestrial Access Network), introduced in 3GPP R8, is the 4G access part of the Evolved Packet System (EPS). data links
SIM Card SlotSupported Subscriber Identification Card (SIM) Format like mini-SIM, micro-SIM, nano-SIM, embedded SIM, etc.  Yes
Complementary Phone ServicesPossible extras: voice transmission, voice speaker, vibration, speakerphone, active noise cancellation, PTT, HD Voice, VoLTE, etc.  Voice transmissionDevice is able to receive and transmit voice over cellular network , Voice speakerDedicated voice speaker is located near to the ear when talking and optimized for the spectrum and peak-to-peak range of the human voice. , Vibrate , Speakerphone , ANCActive noise cancellation (ANC)

Secondary Cellular PhoneSecondary Cellular Phone: 
Sec. Supported Cellular Networks:   No

Control PeripheralsControl Peripherals: 
Touchscreen TypeDetermines how the touchscreen module senses the touch of the screen  Capacitive multi-touch screen

Communication InterfacesCommunication Interfaces: 
Expansion InterfacesNon-volatile memory and/or I/O expansion interfaces. For example: microSD, microSDXC, SDHC, CF II., PCMCIA III., etc.  TransFlash , microSDSupports memory cards with capacity of up to 2GB and may comply with some (not HC) memory cards with higher capacity than 2GB , microSDHCA micro-SDHC-capable device supports High Capacity (SD 2.0/HC) memory cards with capacity of up to 32GB. , microSDXCA microSDXC-capable device supports eXtended-Capacity memory cards with capacity of up to 128 GB, 256 GB or 2 TB.
USBFirst or the only USB port. USB is a common high-speed serial bus standard that allows data and power transfer between the mobile device and another computer. Version of USB identifies USB standard.  USB 3.0 / 3.1 Gen 1 / 3.2 Gen 1x1Released in November 2008, USB 3.0 specification introduced USB SuperSpeed enabling devices to communicate at 5 Gbit/s. Later renamed as USB 3.1 Gen 1, then USB 3.2 Gen 1x1
USB SS (5 Gbps)Determines the highest available data transfer speed of first USB port. Usual standard speed levels: High-Speed (HS), Super-Speed (SS)
USB ServicesPossible services: USB power supply, USB charging, USB fast charging, USB host, OTG, etc.  USB chargingThe device is able to charge its battery supplied from the USB port. , USB fast chargingFast charging is supported , USB HostUSB host devices are capable of controlling USB client devices, like mass storage devices, mouse, keyboard, camera, printer, scanner, etc. , USB OTG 1.3 , USB PDDevice which meets USB Battery Charging Specification Revision 1.1 / 1.2 is able to supply current from 500 mA to 1.5 A for the client device at 5V.
USB ConnectorPhysical USB connector layout. Most common types: micro-USB, USB A, USB Type-C or proprietary (e.g. Lightning)  USB Micro-AB
BluetoothIEEE 802.15 is a short-range radio technology standard that allows transfer of data, and the use of accessories such as wireless audio devices and printers. This field specifies the supported BT version.  Bluetooth 4.1Bluetooth 4.1 is an evolutionary update to the Bluetooth Core Specification. It rolls up adopted Bluetooth Core Specification Addenda (CSA1, 2, 3 & 4) while adding new features and benefits. Bluetooth 4.1 improves usability for consumers, empowers inn
Wireless LANWireless LAN / WLAN / Wi-Fi: 802.11 defines a medium-range wireless data link that allows for internet access and data transfer. This field enumerates the supported protocols (e.g. 802.11a/b/g/n).  802.11aShort range standard, 5 GHz, max. 54 Mbit/s , 802.11b2.4 GHz (ISM band), max. 11 Mbit/s , 802.11g2.4 GHz (ISM band), max. 54 Mbit/s , 802.11n2.4 GHz (ISM band) or optional 5 GHz support, max. 600 Mbit/s thanks to MIMO antennas , 802.11ac2.4 GHz (ISM band) or optional 5 GHz support (4915...5825 MHz), max. 1300 Mbit/s thanks to MIMO antennas
NFCNear Field Communication is short-range wireless radio data exchange technology based on radio-frequency identification (RFID). This field enumerates the supported NFC technologies.  Yes

Multimedia BroadcastMultimedia Broadcast: 
FM Radio ReceiverWith a bulit-in FM radio the device is able to receive FM (frequency modulated) broadcast in 79 - 108 MHz band.  FM radio (88-108 MHz) with RDSFM radio (87.5-108MHz) with RDS


Satellite NavigationSatellite Navigation: 
Complementary Satellite ServicesPossible extras: S-GPS, A-GPS, Geotagging, TMC, QuickGPS, QZSS, etc.  Simultaneous GPS , A-GPS , Geotagging , QuickGPS
Supported GLONASS protocol(s)GLONASS is a global satellite navigation system operated by Russia.  L1OFGLONASS L1OF FDMA signal centered at 1602 MHz, features a BPSK(0.5) modulation.

Primary Camera SystemPrimary Camera SystemPrimary camera usually has better imaging capabilities than secondary camera if any
Camera PlacementRefers to the placement of the primary camera on the device. Front, rear or rotatable. Generally rear.  Rear
Camera Image SensorRefers to the semiconductor technology of image sensor (FSI CMOS, BSI CMOS, etc.)  CMOSComplementary MOS circuit
Number of effective pixelsA measurement of the maximum pixel number at which the camera can take a picture, often referred to as Megapixels (when horizontal and vertical measurements are multiplied) 13.0 MP camera
ZoomA feature that changes the focal length of the lens of a camera. Optical zoom requires the lens to move in and out, providing high-quality close ups from a distance 1.0 x optical zoom
FocusCD AF, PD AF, Laser AF, etc. No / Not supported means there is no adjustable optical system or no camera built-in at all  CD AFContrast-detection (CD) is a passive autofocus method without distance measurement which adjusts the optical system until maximum contrast is measured through the lens.
Video RecordingA measurement of the maximum horizontal and vertical pixel numbers at which the primary camera can capture video 3840x2160 pixel
30 fpsRecording frame rate when recording video at maximum resolution
FlashA flash is used to brighten dark areas when taking photographs; is also used as a flashlight. This field contains the exact type of the flash.  dual LED
Camera Extra FunctionsPopular extra features of the primary camera: EIS, EIS for video, OIS, OIS for video, Face detection, 3D photo, HDR photo, HDR video, Macro mode, Panorama Photo, Red-eye reduction, Refocus, Smile detection, Slow motion video, Burst mode, Face Retouch  OISOIS (also know as IS, OS, VR, AS) utilizies precision electromechanic actuators in the lens which modifies the optical path to the image sensor to compensate the motion of the camera. , Slow motion videoSlowmo cameras are able to achieve at least 100 frame per second frame rate. , Macro modeAn autofocus feature that allows for close-up photographs to be taken with the onboard digital camera
Aux. Camera Image SensorAuxiliary camera image sensor technology in at least dual lens setup  No
Aux. 2 Camera Image SensorAuxiliary 2 camera image sensor technology in at least triple lens setup  No
Aux. 3 Camera Image SensorAuxiliary 3 camera image sensor technology in at least quad lens setup  No
Aux. 4 Camera Image SensorAuxiliary 4 camera image sensor technology in at least penta lens setup  No

Secondary Camera SystemSecondary Camera SystemWidely used for video telephony or taking selfies
Secondary Camera PlacementRefers to the placement of the secondary camera on the device. Front or rear. Generally front camera for selfies or video call.  Front
Secondary Camera SensorRefers to the semiconductor technology of sec camera image sensor (FSI CMOS, BSI CMOS, etc.)  CMOSComplementary MOS circuit
Secondary Camera Number of pixelsA measurement of the maximum pixel number at which the sec. camera can take a picture, often referred to as Megapixels (when horizontal and vertical measurements are multiplied) 4.0 MP sec. cam
Secondary Video RecordingA measurement of the maximum horizontal and vertical pixel numbers at which the secondary camera can capture video 1920x180 pixel
30 fpsRecording frame rate when recording video by the secondary camera at maximum resolution
Sec. Aux. Cam. Image SensorImage sensor technology of sec. auxiliary camera in at least dual lens secondary camera setup  No

Built-in SensorsBuilt-in Sensors: 
Built-in compassBuilt-in electroinc compass types: 1D, 2D, 3D  3D compass
Built-in accelerometerAn internal component that senses acceleration components of the device. Used for automatic screen rotation and for games and applications that rely on acceleration measurement on X, Y, and Z axis. Possible types: 1D, 2D, 3D  3D accelerometer
Built-in gyroscopeAn internal component that senses the orientation of the device. Used for automatic screen rotation and for games and applications that rely on the devices position in the X, Y, and Z axis. Possible types: 1D, 2D, 3D  3D gyro
Additional sensorsBuilt-in ambient (barometer, temperature, altimeter, light, etc.), biometric (fingerprint, HR, step, etc.) and comfort (hall sensor, gesture sensor, proximity, etc.) sensors  FP sensorDevice is able to identify the user by using a built-in dedicated biometric fingerprint recogniser sensor placed at the front, rear or any side of the device , Humidity sensor , L sensorBy measuring the intensity of the ambient light device may control the brightness level of the screen , T sensor

Ingress ProtectionIngress Protection: 
Protection from solid materialsIngress Protection Standards. IP First digit: Protection from solid objects or materials  Yes
Protection from liquidsIngress Protection Standards. IP Second digit: Protection from liquids  Yes

Power SupplyPower Supply: 
BatteryBattery technology  Li-ion
removablePossible options: removable, built-in
1-cellIn case of high power consumption it is more efficient to connect more than 1 cells in the battery in series to minimize current thus loss.
Nominal Battery CapacityIf there are more than 1 cells in the battery in parellel connection the nominal resulting battery capacity is the sum of capacity of cells 3020 mAh battery

Geographical AttributesGeographical Attributes: 

Datasheet AttributesDatasheet Attributes: 
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Preliminary
AddedThe exact time of the datasheet addition 2014-11-24 23:08
 

Qualcomm 810 Smartphone MDP

Qualcomm 810 Smartphone MDP
Platform: android A/V Out: hdmi Audio Output: audio_jack Supported Cellular Bands: gsm Supported Cellular Data Links: gprs Supported Cellular Data Links: edge Supported Cellular Data Links: umts Supported Cellular Data Links: hspa Supported Cellular Data Links: hspa_plus Supported Cellular Data Links: lte Complementary Phone Services: phone Complementary Phone Services: vibration Complementary Phone Services: speakerphone Expansion Interfaces USB: usb3 USB Services: usb_otg Bluetooth Wireless LAN NFC FM Radio Receiver Complementary Satellite Services Supported GLONASS protocol(s) Number of effective pixels: 13.0 MP camera Aux. Camera Number of Pixels : 0.0 MP aux. cam Secondary Camera Number of pixels: 4.0 MP sec. cam Built-in compass Built-in accelerometer Built-in gyroscope Additional sensors: temperature Additional sensors: fingerprint

See also

Qualcomm 805 Tablet MDP
Qualcomm 805 Tablet MDP
Google Android 4.4.4 (KitKat), Qualcomm Snapdragon 805 APQ8084AB Pro (8084 Fusion 4.5), 3 GiB RAM, 64 GB ROM, 10.1 inch, 2560x1440, 13.0 MP camera, 2.1 MP sec. cam | All detailsAll details | Add this item to the comparisonAdd to compare

Qualcomm 810 Tablet MDP
Qualcomm 810 Tablet MDP
Google Android 4.4.4 (KitKat), Qualcomm Snapdragon 810 MSM8994 v2.0, 4 GiB RAM, 64 GB ROM, 10.1 inch, 3840x2160, 13.0 MP camera, 4.0 MP sec. cam | All detailsAll details | Add this item to the comparisonAdd to compare

Qualcomm pdQ 1900
Qualcomm pdQ 1900
67x157x30 mm, Palm Computing Palm OS 3.0, Motorola DragonBall MC68328, 2 MiB RAM, 2 MiB ROM, 3.5 inch, 240x160 | All detailsAll details | Add this item to the comparisonAdd to compare

Qualcomm pdQ 800
Qualcomm pdQ 800
67x157x30 mm, Palm Computing Palm OS 3.0, Motorola DragonBall MC68328, 2 MiB RAM, 2 MiB ROM, 3.5 inch, 240x160 | All detailsAll details | Add this item to the comparisonAdd to compare

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