PhoneDB - infinitely detailed




FacebookGoogle PlusRSS FeedTwitter
Device SpecsDevice Specs5 
Search 
Compare 
List all 
FirmwareFirmware 
Search 
List all 
Processor SpecsProcessor Specs 
Search 
Compare 
List all 
OS SpecsOS Specs 
Search 
Compare 
List all 
Mobile OperatorsMobile Operators 
Search 
Compare 
List all 

IntroductionIntroduction: 
BrandBrand name of the device. This may match with the manufacturer Fujitsu
ModelOne or more (separated by /) specific model name identifies this device. This field often includes Model Code too which can be separated Arrows We 2 TD-LTE JP FCG02
BriefBrief Introduction: One or two sentences which enumerates some important attributes of the specifc device variant described by this datasheet
Simply slide your finger from the specified location to quickly launch registered apps and functions
ReleasedFirst official market release date in (year, month) 2024 Aug 16
AnnouncedDate of the official announcement (year, month) 2024 May 16
Hardware DesignerThe company which designed this device Fujitsu
ManufacturerThe company which produces this device Fujitsu
OEM IDThe OEM ID is internal code and refers to a specific variant of the model series FMP198-O3
General ExtrasHardware extras like stylus, kickstand, rotatatble screen, rotatable keyboard, haptic feedback, etc.  Haptic touch feedbackHaptic (inlcuding kinesthetic) touch device applies forces and vibrations to give feedback to the user when tapping the touchscreen
Device CategorySmartphone, tablet, smart watch, PDA, palmtop, etc.  SmartphoneCallular voice-capable usually touchscreen mobile computer which natively runs third-party apps.

Physical AttributesPhysical Attributes: 
WidthWidth is horizontally measured between the left and right edges of device according to the default display orientation 73 mm
HeightHeight is vertically measured between the bottom and top edges of device according to the default display orientation 155 mm
DepthDepth refers to the thickness of the device. Depth is usually the smallest dimension of the device 8.9 mm
DimensionsAll dimensions are maximal values (measured between the furthest points of the device) in closed state 2.87x6.1x0.35 inches
MassThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in grams 179 g
6.31 ouncesThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in ounces

Software EnvironmentSoftware Environment: 
PlatformThe family of the operating system like Android, iOS, Windows Phone/Mobile, Palm OS, etc.  Android
Operating SystemPre-installed (usually embedded) operating system which the device was released with. Google Android 14 (Upside Down Cake)Google Android 14 (Upside Down Cake)
Software ExtrasNavigation software, voice recognition, face recognition, personal assistant app, etc.  Voice Command , Navigation softwarepre-installed , Intelligent personal assistantLearning personal assistant based on artificial intelligence (AI) , Face RecognitionFace identification by built-in camera

Application processor, ChipsetApplication processor, Chipset: 
CPU ClockFrequency of the square signal which schedules the internal operation of microprocessor (synchronous sequential logic). The current consumed by the processor is approximately proportional to clock rate. 2500 MHz
CPUManufacturer part number and most important characteristics of the IC which includes the main application processor or processors MediaTek Dimensity 7025 MT6855, 2024, 64 bit, octa-core, 6 nm, IMG BXM-8-256 GPUMediaTek Dimensity 7025 MT6855, 2024, 64 bit, octa-core, 6 nm, IMG BXM-8-256 GPU

Operative MemoryOperative Memory: 
RAM TypeType of volatile memory IC which specifies RAM architecture, timing characteristics, refresh mode, voltage levels and physical design of the IC. Two major types of random-access memory is static RAM (SRAM) periodically refreshed dynamic RAM (DRAM).  Yes
RAM Capacity (converted)RAM capacity in binary bytes (KiB: 1024 bytes, MiB: 1024 KiB, GiB: 1024 MiB) 4 GiB RAM

Non-volatile MemoryNon-volatile Memory: 
Non-volatile Memory InterfaceInterface (e.g. UFS 2.0, eMMC 5.1, moviNAND) which determines physical layer (width, clock rate, lanes, protocol) of data transfer between the application processor and the NV memory  UFS 3.1UFS 3.1 (released as JESD220E in 2020) defines single-lane 1.45 GB/s or dual-lane 2.9 GB/s NAND flash EEPROM interface
Non-volatile Memory Capacity (converted)The value of ROM capacity converted to the most appropriate units (KiB: 1024 bytes, KB: 1000 bytes, MiB: 1024 KiB, MB: 1000 KB, GiB: 1024 MiB, GB: 1000 MB) 64 GB ROM

DisplayDisplayAll parameters that related to display
Display NotchNumber of display notches (or cutouts) 1-notch
Display DiagonalThe distance measured between the furthest corners of the display. In case of display with rounded edges this refers to the diagonal of the smallest bounding rectangle. 155 mm
6.1 inchDisplay Diagonal in inches
ResolutionHorizontal and vertical resolution of the primary display. In case of display with rounded edges this refers to the smallest bounding rectangle. 720x1560
Horizontal Full Bezel WidthDefined as the sum of width of left and right vertical display bezels. If the display panel is located in the middle width of left and right bezels are the same and their width is the half of the full bezel width. 8.05 mm
Display Area UtilizationRegular display area per regular front panel area ratio. This approximated indicator does not count with possible rounded corners (neither on front panel nor on display) or display notches, holes. 80.8%
Pixel DensityIndicates the number of pixels per inch 282 PPI
Display TypeDisplay technology, e.g. Color/ monochrome e-ink, STN, PM-OLED, AM-OLED, TN-TFT, IPS TFT, ASV TFT, MVA TFT, PVA TFT, PLS TFT  Color IPS TFT LCDColor IPS-TFT (In-Plane Switching - Thin Film Transistor) is also called Super TFT LCD. This is an active matrix LCD technology developed by Hitachi Ltd. in 1996. display
Number of Display ScalesMaximal number of displayable colors or scales 16.8M
Scratch Resistant ScreenUsual types: Gorilla Glass generations, DragonTrail/X, Sapphire Glass  Yes

Graphical SubsystemGraphical Subsystem: 
Graphical ControllerManufacturer and part number of the graphics controller IC or commercial name of the intellectual property (IP) if the graphics controller is the part of a chipset IMG BXM-8-256

Audio/Video InterfacesAudio/Video Interfaces: 
A/V OutAudio/Video outputs form a heterogeneous group of interfaces that allow the user to connect the device to various external analog/digital multimedia devices (monitors, projectors, HD TVs) and play multimedia content. For example: MHL, DisplayPort, HDMI, e  No

Audio SubsystemAudio Subsystem: 
Microphone(s)Analog or digital sound receiver. Main applications: voice calls, active noise cancellation, voice command, voice/video recording, voice identification  stereo
Loudspeaker(s):   mono
Audio Output:   3.5mm

Cellular PhoneCellular Phone: 
Supported Cellular BandsList of supported cellular networks with band names. For example GSM900 refers to the GSM system with the 890-915 MHz uplink and 935-960 downlink bands.  GSM850GSM850 phones support GSM 850 MHz (B5) band (downlink: 869.2 MHz - 894.2 MHz, uplink: 824.2 MHz - 849.2 MHz) , GSM900GSM900 phones support P-GSM (Primary GSM) 900 MHz (B8) band (downlink: 935.0 MHz - 960.0 MHz, uplink: 890.0 MHz - 915.0 MHz) and may support E-GSM (Extended GSM) 900 MHz band (downlink: 925.0 MHz - 960.0 MHz, uplink: 880.0 MHz- 915.0 MHz. , GSM1800GSM1800 phones support GSM / DCS / PCS 1800 MHz (B3) band (downlink: 1805.2 - 1879.8 MHz, uplink: 1710.2 - 1784.8 MHz). , GSM1900GSM1900 phones support PCS 1900 MHz (B2) band (downlink: 1930.2 - 1989.8 MHz, uplink: 1850.2 - 1909.8 MHz) , UMTS2100 (B1)UMTS2100 phones support UMTS 1900 / 2100MHz (IMT, also refferred as UMTS Band I) band (downlink: 2112.4 - 2167.6 MHz, uplink: 1922.4-1977.6 MHz) , UMTS850 (B5)UMTS850 phones support UMTS 850 MHz (CLR, also refferred as UMTS Band V) band (downlink: 871.4 - 891.6 MHz, uplink: 826.4 - 846.6 MHz) , LTE2100 (B1)LTE2100 phones support LTE 1900 / 2100MHz (IMT, also refferred as LTE Band 1) band (downlink: 2110 - 2170 MHz, uplink: 1920 - 1980 MHz) , LTE1800 (B3)LTE1800 phones support LTE 1800 MHz (LTE Band 3) band (downlink: 1805 - 1880 MHz, uplink: 1710 - 1785 MHz) , LTE900 (B8)LTE900 phones support LTE 900 MHz (LTE Band 8) band (downlink: 925 - 960 MHz, uplink: 880 - 915 MHz) , LTE800 (B18)LTE800 phones support LTE 800 MHz (LTE Band 18) band (downlink: 860 - 875 MHz, uplink: 815 - 830 MHz) , LTE800 (B19)LTE800 phones support LTE 800 MHz (LTE Band 19) band (downlink: 875 - 890 MHz, uplink: 830 - 845 MHz) , LTE850 (B26)LTE850 phones support LTE 850 MHz (LTE Band 26) band (downlink: 859 - 894 MHz, uplink: 814 - 849 MHz) , LTE700 (B28)APT700 phones support LTE 700 MHz (LTE Band 28) band (downlink: 758 - 803 MHz, uplink: 703 - 748 MHz) , TD-LTE2500 (B41)TD-LTE 2500 MHz phones support TD-LTE 2500 MHz (LTE Band 41) band (2496 - 2690 MHz) , TD-LTE3500 (B42)TD-LTE 3500 MHz phones support TD-LTE 3500 MHz (LTE Band 42) band (3400 - 3600 MHz) , NR1800 (N3)NR1800 phones support 1800 MHz DCS band (downlink: 1805 - 1880 MHz, uplink: 1710 - 1785 MHz) , NR700 (N28)5G APT700 phones support 700 MHz APT band (downlink: 758 - 803 MHz, uplink: 703 - 748 MHz) , TD-NR2500 (N41)5G NR TDD 2500 MHz phones support 2500 MHz (N41) FR1 band (2496 - 2690 MHz) , TD-NR3700 (N77)5G NR TDD 3700 MHz phones support 3700 MHz TDD C-Band (N77) band (3300 - 4200 MHz) , TD-NR3500 (N78)5G NR TDD 3500 MHz phones support 3500 MHz TDD C-Band (N78) band (3300 - 3800 MHz) bands
Supported Cellular Data LinksList of supported cellular data links and rates.  GPRSGeneral Packet Radio Service , EDGEEnhanced Data Rates for GSM Evolution also known as Enhanced GPRS (EGPRS) , UMTSUniversal Mobile Telecommunications System. UMTS Release '99 data link layer, W-CDMA grants up to 384 kbit/s pocket-switched download speed. , HSUPAHigh-Speed Uplink Packet Access is a 3.5G UMTS uplink protocol. , HSDPAHigh-Speed Downlink Packet Access is a 3.5G UMTS downlink protocol. , HSDPA 14.4 , HSPA+ 21.1 , DC-HSDPA 42.2Dual-carrier HSPA+ 42.2 Mbps , LTELTE (Long Term Evolution) or the E-UTRAN (Evolved Universal Terrestrial Access Network), introduced in 3GPP R8, is the 4G access part of the Evolved Packet System (EPS). , LTE 50/25LTE 50.4 Mbps / 25.2 Mbps (Cat. 2) , LTE 75/25LTE 75.6 Mbps / 25.2 Mbps (Cat. 3) , LTE 100/50LTE 100.8 Mbps / 50.4 Mbps (Cat. 3) , LTE 150/50LTE 151.2 Mbps / 50.4 Mbps (Cat. 4) , LTE 300/50More exact values: LTE 301.5 Mbps / 50.4 Mbps (Cat. 6) , LTE 300/75LTE 299.6 Mbps / 75.6 Mbps (Cat. 5) , LTE 450/50LTE Category 9: 452.2 Mbps downlink, 51 Mbps uplink , LTE 600/50LTE Category 11: 603 Mbps downlink, 51 Mbps uplink , NR 15005G NR approx. 1.5 Gbps downlink (FR1) , NR 26005G NR approx. 2.6 Gbps downlink (FR1, Sub6) data links
SIM Card SlotSupported Subscriber Identification Card (SIM) Format like mini-SIM, micro-SIM, nano-SIM, embedded SIM, etc.  e-SIM , Nano-SIM (4FF)
Complementary Phone ServicesPossible extras: voice transmission, voice speaker, vibration, speakerphone, active noise cancellation, PTT, HD Voice, VoLTE, etc.  Voice transmissionDevice is able to receive and transmit voice over cellular network , Voice speakerDedicated voice speaker is located near to the ear when talking and optimized for the spectrum and peak-to-peak range of the human voice. , Vibrate , Speakerphone , ANCActive noise cancellation (ANC) , HD Voice , VoLTE
SAR (head)Measured SAR value at head configuration 1.247 W/kg
SAR (body)Measured SAR value at body configuration 0.788 W/kg

Secondary Cellular PhoneSecondary Cellular Phone: 
Sec. Supported Cellular Networks:   No

Control PeripheralsControl Peripherals: 
Touchscreen TypeDetermines how the touchscreen module senses the touch of the screen  Capacitive multi-touch screen

Communication InterfacesCommunication Interfaces: 
Expansion InterfacesNon-volatile memory and/or I/O expansion interfaces. For example: microSD, microSDXC, SDHC, CF II., PCMCIA III., etc.  TransFlash , microSDSupports memory cards with capacity of up to 2GB and may comply with some (not HC) memory cards with higher capacity than 2GB , microSDHCA micro-SDHC-capable device supports High Capacity (SD 2.0/HC) memory cards with capacity of up to 32GB. , microSDXCA microSDXC-capable device supports eXtended-Capacity memory cards with capacity of up to 128 GB, 256 GB or 2 TB.
USBFirst or the only USB port. USB is a common high-speed serial bus standard that allows data and power transfer between the mobile device and another computer. Version of USB identifies USB standard.  USB 2.0Released in April 2000, USB 2.0 specification introduced USB Hi-Speed enabling devices to communicate at 480 Mbit/s data rate.
USB HS (480 Mbps)Determines the highest available data transfer speed of first USB port. Usual standard speed levels: High-Speed (HS), Super-Speed (SS)
USB ServicesPossible services: USB power supply, USB charging, USB fast charging, USB host, OTG, etc.  USB chargingThe device is able to charge its battery supplied from the USB port. , USB fast chargingFast charging is supported , USB HostUSB host devices are capable of controlling USB client devices, like mass storage devices, mouse, keyboard, camera, printer, scanner, etc. , USB OTG 1.3 , USB PDDevice which meets USB Battery Charging Specification Revision 1.1 / 1.2 is able to supply current from 500 mA to 1.5 A for the client device at 5V. , USB PD 2.0Device which meets USB Power Delivery 2.0 is able to supply current from 3 A to 5 A for the client device at 20V. , USB PD 3.0USB PD Revision 3.0 supports 100W power delivery on 20V using USB Type-C cables rated at 5A
USB ConnectorPhysical USB connector layout. Most common types: micro-USB, USB A, USB Type-C or proprietary (e.g. Lightning)  USB C reversible
BluetoothIEEE 802.15 is a short-range radio technology standard that allows transfer of data, and the use of accessories such as wireless audio devices and printers. This field specifies the supported BT version.  Bluetooth 5.2Released in Dec, 2019
Wireless LANWireless LAN / WLAN / Wi-Fi: 802.11 defines a medium-range wireless data link that allows for internet access and data transfer. This field enumerates the supported protocols (e.g. 802.11a/b/g/n).  802.11aShort range standard, 5 GHz, max. 54 Mbit/s , 802.11b2.4 GHz (ISM band), max. 11 Mbit/s , 802.11g2.4 GHz (ISM band), max. 54 Mbit/s , 802.11n2.4 GHz (ISM band) or optional 5 GHz support, max. 600 Mbit/s thanks to MIMO antennas , 802.11ac2.4 GHz (ISM band) or optional 5 GHz support (4915...5825 MHz), max. 1300 Mbit/s thanks to MIMO antennas
Wireless ServicesPossible extras: Miracast, DLNA, WiFi Tethering, UPnP, WiFi Display, AirPlay, etc.  MiracastMiracast screensharing standard uses Wi-Fi Direct connection , Wi-Fi TetheringWi-Fi Mobile Hotsport , WiDiIntel Wireless Display
NFCNear Field Communication is short-range wireless radio data exchange technology based on radio-frequency identification (RFID). This field enumerates the supported NFC technologies.  NFC AISO/IEC 14443 Type A , NFC BISO/IEC 14443 Type B , FeliCaFelicity Card RFID smart card system for Japan developed by Sony.

Multimedia BroadcastMultimedia Broadcast: 
FM Radio ReceiverWith a bulit-in FM radio the device is able to receive FM (frequency modulated) broadcast in 79 - 108 MHz band.  FM radio (76-108 MHz) with RDS


Satellite NavigationSatellite Navigation: 
Complementary Satellite ServicesPossible extras: S-GPS, A-GPS, Geotagging, TMC, QuickGPS, QZSS, etc.  Simultaneous GPS , A-GPS , Geotagging , QuickGPS , QZSSQuasi-Zenith Satellite System
Supported GLONASS protocol(s)GLONASS is a global satellite navigation system operated by Russia.  L1OFGLONASS L1OF FDMA signal centered at 1602 MHz, features a BPSK(0.5) modulation.
Supported Galileo service(s)Galileo is a global satellite navigation system operated by European Union and the European Space Agency.  E1Galileo E1 band centered at 1575.42 MHz and with a reference bandwidth of 24.552 MHz, uses the Composite Binary Offset Carrier (CBOC) modulation
Supported BeiDou system (BDS)BeiDou System (BDS) is a Chinese satellite navigation system. Its global variant is the BeiDou-2 alias COMPASS.  B1IBeiDou-2 (COMPASS) B1I signal transmitted by BDS-2 satellites is centered at 1561.098 MHz, featuring a QPSK(2) modulation BeiDou receiver

Primary Camera SystemPrimary Camera SystemPrimary camera usually has better imaging capabilities than secondary camera if any
Camera PlacementRefers to the placement of the primary camera on the device. Front, rear or rotatable. Generally rear.  Rear
Camera Image SensorRefers to the semiconductor technology of image sensor (FSI CMOS, BSI CMOS, etc.)  BSI CMOSBackside Illuminated CMOS (Complementary MOS circuit)
Number of effective pixelsA measurement of the maximum pixel number at which the camera can take a picture, often referred to as Megapixels (when horizontal and vertical measurements are multiplied) 50.1 MP camera
Aperture (W)Wide-angle aperture of lens or aperture of lens in case of camera without optical zoom f/1.80
ZoomA feature that changes the focal length of the lens of a camera. Optical zoom requires the lens to move in and out, providing high-quality close ups from a distance 1.0 x optical zoom
8.0 x digital zoomDigital zoom is an image signal processing method which cuts out and enlarges a desired part of the captured image while losing the rest of the image
FocusCD AF, PD AF, Laser AF, etc. No / Not supported means there is no adjustable optical system or no camera built-in at all  PD AFPhase-detection (PD) is a passive autofocus system which measures the phase difference between a two images to reach correct focus.
Video RecordingA measurement of the maximum horizontal and vertical pixel numbers at which the primary camera can capture video 1920x1080 pixel
30 fpsRecording frame rate when recording video at maximum resolution
FlashA flash is used to brighten dark areas when taking photographs; is also used as a flashlight. This field contains the exact type of the flash.  single LEDAlso known as mobile light
Camera Extra FunctionsPopular extra features of the primary camera: EIS, EIS for video, OIS, OIS for video, Face detection, 3D photo, HDR photo, HDR video, Macro mode, Panorama Photo, Red-eye reduction, Refocus, Smile detection, Slow motion video, Burst mode, Face Retouch  EISEIS (or digital IS) uses further buffer pixels around the active pixel matrix and dinamically shifts the recorded image in 4 direction to compensate the motion of the camera. , EIS (video) , Pixel unificationThis method reduces image noise in low light conditions by merging 4 sensor pixels to 1 pixel (or 9 sensor pixels to 1) at the cost of quartering (or 1/9) the resolution. Also known as 4-in-1 pixel (or 9-in-1) fusion or super pixel mode , HDR photoHigh dynamic range image recording , Slow motion videoSlowmo cameras are able to achieve at least 100 frame per second frame rate. , Burst mode , Touch focus , Macro modeAn autofocus feature that allows for close-up photographs to be taken with the onboard digital camera , Panorama Photo , Face detection , Face tagging , Smile detection , Face retouch
Aux. Camera Image SensorAuxiliary camera image sensor technology in at least dual lens setup  CMOSComplementary MOS circuit
Aux. Camera Number of Pixels Number of effective pixels of Auxiliary Camera (2nd camera of primary camera system) in at least dual lens camera setup 1.9 MP aux. cam
Aux. Camera Aperture (W)Wide-angle aperture of aux. lens or aperture of aux. lens in case of aux. camera without optical zoom f/2.40
Aux. Camera Extra FunctionsPopular extra features of the aux. camera: OIS, EIS, HDR photo  Burst mode
Aux. 2 Camera Image SensorAuxiliary 2 camera image sensor technology in at least triple lens setup  No
Aux. 3 Camera Image SensorAuxiliary 3 camera image sensor technology in at least quad lens setup  No
Aux. 4 Camera Image SensorAuxiliary 4 camera image sensor technology in at least penta lens setup  No

Secondary Camera SystemSecondary Camera SystemWidely used for video telephony or taking selfies
Secondary Camera PlacementRefers to the placement of the secondary camera on the device. Front or rear. Generally front camera for selfies or video call.  Front
Secondary Camera SensorRefers to the semiconductor technology of sec camera image sensor (FSI CMOS, BSI CMOS, etc.)  BSI CMOSBackside Illuminated CMOS (Complementary MOS circuit)
Secondary Camera Number of pixelsA measurement of the maximum pixel number at which the sec. camera can take a picture, often referred to as Megapixels (when horizontal and vertical measurements are multiplied) 8.0 MP sec. cam
Secondary Aperture (W)Wide-angle aperture of lens or aperture of lens in case of secondary camera without optical zoom f/2.00
Secondary Video RecordingA measurement of the maximum horizontal and vertical pixel numbers at which the secondary camera can capture video 1920x1080 pixel
30 fpsRecording frame rate when recording video by the secondary camera at maximum resolution
Secondary Camera Extra FunctionsPopular extra features of the secondary camera: Face detection, HDR photo, Selfie Panorama, Smile detection, Face Retouch / Face Beautification  HDR photoHigh dynamic range image recording , Burst mode , Panorama Photo , Face detection , Face tagging , Smile detection , Face retouch
Sec. Aux. Cam. Image SensorImage sensor technology of sec. auxiliary camera in at least dual lens secondary camera setup  No

Built-in SensorsBuilt-in Sensors: 
Built-in compassBuilt-in electroinc compass types: 1D, 2D, 3D  Yes
Built-in accelerometerAn internal component that senses acceleration components of the device. Used for automatic screen rotation and for games and applications that rely on acceleration measurement on X, Y, and Z axis. Possible types: 1D, 2D, 3D  Yes
Built-in gyroscopeAn internal component that senses the orientation of the device. Used for automatic screen rotation and for games and applications that rely on the devices position in the X, Y, and Z axis. Possible types: 1D, 2D, 3D  Yes
Additional sensorsBuilt-in ambient (barometer, temperature, altimeter, light, etc.), biometric (fingerprint, HR, step, etc.) and comfort (hall sensor, gesture sensor, proximity, etc.) sensors  FP sensorDevice is able to identify the user by using a built-in dedicated biometric fingerprint recogniser sensor placed at the front, rear or any side of the device , L sensorBy measuring the intensity of the ambient light device may control the brightness level of the screen , P sensorBased on this sensor signal device may control the volume of the voice speaker or dim the display during a call

Ingress ProtectionIngress Protection: 
Protection from solid materialsIngress Protection Standards. IP First digit: Protection from solid objects or materials  6 Totally protected from dust
Protection from liquidsIngress Protection Standards. IP Second digit: Protection from liquids  8 Protected against immersion beyond 1m of depth
Protection against mechanical impacts Ingress Protection Standards. IP Third number: Protection against mechanical impacts (commonly omitted). Device is protected against impact with the following potential energy values. example: Protects against impact of 0.225 joule (e.g. 150g body falli 150 cm
Immersion into liquids (depth limit)Device is protected against immersion into this depth of liquid (usually water) at most. (IP rating) 150 cm
Immersion into liquids time limitProtected against immersion into liquids within this time limit (in minutes). (IP rating) 30 min
Military Standard Compliance (MIL-STD)Highest level of Military Standard Compliance  MIL-STD-810H

Power SupplyPower Supply: 
BatteryBattery technology  Li-ion polymer (LiPo)
built-inPossible options: removable, built-in
1-cellIn case of high power consumption it is more efficient to connect more than 1 cells in the battery in series to minimize current thus loss.
Nominal Battery CapacityIf there are more than 1 cells in the battery in parellel connection the nominal resulting battery capacity is the sum of capacity of cells 4500 mAh battery
Talk Time:  35.5 hours

Geographical AttributesGeographical Attributes: 
Market CountriesCountries where the device was officially sold. Overlap is possible.  Japan
Market RegionsRegions where the device was officially sold. Overlap is possible.  Asia
Mobile OperatorList of mobile operators (carriers) or distributors which sold the device in their own network KDDI CorporationKDDI Corporation
UQ CommunicationsUQ Communications
PriceGross end user price recommended by the manufacturer on the day of product release 22001
JPYCurrency of the given gross end user price

Datasheet AttributesDatasheet Attributes: 
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Final
AddedThe exact time of the datasheet addition 2024-09-03 10:55
 

Fujitsu Arrows We 2 TD-LTE JP FCG02

Fujitsu Arrows We 2 TD-LTE JP FCG02
Platform: android Audio Output: audio_jack Supported Cellular Bands: gsm Supported Cellular Data Links: gprs Supported Cellular Data Links: edge Supported Cellular Data Links: umts Supported Cellular Data Links: hspa Supported Cellular Data Links: hspa_plus Supported Cellular Data Links: lte Supported Cellular Data Links: lte-a Complementary Phone Services: phone Complementary Phone Services: vibration Complementary Phone Services: speakerphone Expansion Interfaces USB Services: usb_otg USB Connector: usb_c Bluetooth Wireless LAN NFC FM Radio Receiver Complementary Satellite Services Supported GLONASS protocol(s) Supported BeiDou system (BDS) Number of effective pixels: 50.1 MP camera Aux. Camera Number of Pixels : 1.9 MP aux. cam Secondary Camera Number of pixels: 8.0 MP sec. cam Built-in compass Built-in accelerometer Built-in gyroscope Additional sensors: fingerprint Protection from liquids: waterproof Protection against mechanical impacts: 150 cm Military Standard Compliance (MIL-STD)
Available at overseas Electronics - www.welectronics.com

Predecessor Model

Fujitsu Arrows We TD-LTE JP FCG01 (Fujitsu B03)
Fujitsu Arrows We TD-LTE JP FCG01 (Fujitsu B03)
71x147x10.2 mm, Google Android 11 (R), Qualcomm Snapdragon 480 5G SM4350 (Holi), 4 GiB RAM, 64 GB ROM, 5.7 inch, 720x1520, 13.0 MP camera, 4.9 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

See also

Fujitsu Arrows We 2 Plus Premium Edition TD-LTE JP M06
Fujitsu Arrows We 2 Plus Premium Edition TD-LTE JP M06
New 75x162x8.5 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 7s Gen 2 5G SM7435-AB, 12 GiB RAM, 256 GB ROM, 6.6 inch, 1080x2400, 50.1 MP camera, 15.9 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Fujitsu Arrows We 2 Plus Standard Edition TD-LTE JP M06
Fujitsu Arrows We 2 Plus Standard Edition TD-LTE JP M06
New 75x162x8.5 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 7s Gen 2 5G SM7435-AB, 8 GiB RAM, 256 GB ROM, 6.6 inch, 1080x2400, 50.1 MP camera, 15.9 MP sec. cam, 5000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Fujitsu Arrows We 2 TD-LTE JP M07
Fujitsu Arrows We 2 TD-LTE JP M07
New FMP200-Y2, 73x155x8.9 mm, Google Android 14 (Upside Down Cake), MediaTek Dimensity 7025 MT6855, 4 GiB RAM, 128 GB ROM, 6.1 inch, 720x1560, 50.1 MP camera, 8.0 MP sec. cam, 4500 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Fujitsu Arrows We 2 TD-LTE JP F-52E
Fujitsu Arrows We 2 TD-LTE JP F-52E
New FMP199-O5, 73x155x8.9 mm, Google Android 14 (Upside Down Cake), MediaTek Dimensity 7025 MT6855, 4 GiB RAM, 64 GB ROM, 6.1 inch, 720x1560, 50.1 MP camera, 8.0 MP sec. cam, 4500 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Fujitsu Arrows N 5G TD-LTE JP F-51C
Fujitsu Arrows N 5G TD-LTE JP F-51C
72x155x10.8 mm, Google Android 12 (S), Qualcomm Snapdragon 695 5G SM6375, 8 GiB RAM, 128 GB ROM, 6.2 inch, 1080x2400, 50.3 MP camera, 12.3 MP sec. cam, 4600 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Fujitsu Arrows BZ03 5G Dual SIM TD-LTE JP (Fujitsu B03)
Fujitsu Arrows BZ03 5G Dual SIM TD-LTE JP (Fujitsu B03)
71x147x10.2 mm, Google Android 12 (S), Qualcomm Snapdragon 480 5G SM4350 (Holi), 4 GiB RAM, 64 GB ROM, 5.7 inch, 720x1520, 13.0 MP camera, 4.9 MP sec. cam, 3520 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Fujitsu Arrows We TD-LTE JP A101FC (Fujitsu B03)
Fujitsu Arrows We TD-LTE JP A101FC (Fujitsu B03)
71x147x10.2 mm, Google Android 11 (R), Qualcomm Snapdragon 480 5G SM4350 (Holi), 4 GiB RAM, 64 GB ROM, 5.7 inch, 720x1520, 13.0 MP camera, 4.9 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Fujitsu Raku-Raku Easy Smartphone TD-LTE JP F-52B
Fujitsu Raku-Raku Easy Smartphone TD-LTE JP F-52B
70x143x9.6 mm, Google Android 11 (R), Qualcomm Snapdragon 480 5G SM4350 (Holi), 4 GiB RAM, 64 GB ROM, 5 inch, 1080x1980, 13.0 MP camera, 8.0 MP sec. cam, 3400 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Fujitsu Arrows We TD-LTE JP F-51B (Fujitsu B03)
Fujitsu Arrows We TD-LTE JP F-51B (Fujitsu B03)
71x147x10.2 mm, Google Android 11 (R), Qualcomm Snapdragon 480 5G SM4350 (Holi), 4 GiB RAM, 64 GB ROM, 5.7 inch, 720x1520, 13.0 MP camera, 4.9 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Fujitsu Arrows BZ01 TD-LTE JP (Fujitsu B01)
Fujitsu Arrows BZ01 TD-LTE JP (Fujitsu B01)
ASMB01V01, 70x147x8.9 mm, Google Android 10 (Q), Qualcomm Snapdragon 450 SDM450, 3 GiB RAM, 32 GB ROM, 5.6 inch, 1080x2220, 12.2 MP camera, 8.1 MP sec. cam, 2780 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Fujitsu Arrows BZ02 Dual SIM LTE-A JP (Fujitsu B02)
Fujitsu Arrows BZ02 Dual SIM LTE-A JP (Fujitsu B02)
ASMB02001, 71x148x9.4 mm, Google Android 11 (R), Qualcomm Snapdragon 460 SM4250-AA, 4 GiB RAM, 64 GB ROM, 5.6 inch, 1080x2220, 13.0 MP camera, 8.1 MP sec. cam, 3600 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Fujitsu Arrows Be4 Plus F-41B TD-LTE JP (Fujitsu B02)
Fujitsu Arrows Be4 Plus F-41B TD-LTE JP (Fujitsu B02)
71x148x9.4 mm, Google Android 11 (R), Qualcomm Snapdragon 460 SM4250-AA, 4 GiB RAM, 64 GB ROM, 5.6 inch, 1080x2220, 13.0 MP camera, 8.1 MP sec. cam, 3600 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Fujitsu Arrows NX9 5G F-52A TD-LTE JP
Fujitsu Arrows NX9 5G F-52A TD-LTE JP
72x152x8.5 mm, Google Android 10 (Q), Qualcomm Snapdragon 765 5G SM7250-AA (Nairo), 8 GiB RAM, 128 GB ROM, 6.3 inch, 1080x2280, 48.4 MP camera, 16.3 MP sec. cam, 3600 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Fujitsu Arrows 5G F-51A TD-LTE JP
Fujitsu Arrows 5G F-51A TD-LTE JP
76x164x7.8 mm, Google Android 10 (Q), Qualcomm Snapdragon 865 5G SM8250 (Kona), 8 GiB RAM, 128 GB ROM, 6.7 inch, 1080x2340, 48.0 MP camera, 32.0 MP sec. cam, 4070 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Fujitsu Arrows Be4 F-41A TD-LTE JP (Fujitsu B01)
Fujitsu Arrows Be4 F-41A TD-LTE JP (Fujitsu B01)
70x147x8.9 mm, Google Android 10 (Q), Qualcomm Snapdragon 450 SDM450, 3 GiB RAM, 32 GB ROM, 5.6 inch, 1080x2220, 12.2 MP camera, 8.1 MP sec. cam, 2780 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

More options

See detailed datasheet
Use the following link to refer to this datasheet:
Did you notice a typo on this datasheet? Click here to report and we will fix it.
You are here: Device Specs \ Fujitsu Arrows We 2 TD-LTE JP FCG02
Jump to top | Database Licensing | Contact | Banner & Text Link Advertising | Help | Sitemap | Privacy Policy

(c) 2006 -2024 PhoneDB. All rights reserved.