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IntroductionIntroduction: 
BrandBrand name of the device. This may match with the manufacturer LeEco
ModelOne or more (separated by /) specific model name identifies this device. This field often includes Model Code too which can be separated X502 LTE Dual SIM
ReleasedFirst official market release date in (year, month) 2016 Jun 22
Hardware DesignerThe company which designed this device Leshi
ManufacturerThe company which produces this device Leshi
Device CategorySmartphone, tablet, smart watch, PDA, palmtop, etc.  SmartphoneCallular voice-capable usually touchscreen mobile computer which natively runs third-party apps.
List of Additional FeaturesComma separated list of low priority special features which are not included in other fields
proxitiy sensor, nano-SIM

Physical AttributesPhysical Attributes: 
WidthWidth is horizontally measured between the left and right edges of device according to the default display orientation 74.2 mm
2.92 inchWidth measured in inches
HeightHeight is vertically measured between the bottom and top edges of device according to the default display orientation 151.1 mm
5.95 inchHeight measured in inches
DepthDepth refers to the thickness of the device. Depth is usually the smallest dimension of the device 7.5 mm
0.3 inchesDepth measured in inches
Bounding VolumeThe volume of the smallest cuboid which can bound the device in cubecentimetres 84.1 ccm
MassThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in grams 169 g
5.96 ouncesThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in ounces

Software EnvironmentSoftware Environment: 
PlatformThe family of the operating system like Android, iOS, Windows Phone/Mobile, Palm OS, etc.  Google Android
Operating SystemPre-installed (usually embedded) operating system which the device was released with. Google Android 5.0.2 (Lollipop)Google Android 5.0.2 (Lollipop)

Application processor, ChipsetApplication processor, Chipset: 
CPU ClockFrequency of the square signal which schedules the internal operation of microprocessor (synchronous sequential logic). The current consumed by the processor is approximately proportional to clock rate. 1900 MHz
CPUManufacturer part number and most important characteristics of the IC which includes the main application processor or processors Samsung Exynos 8 Octa 8870, 2016, 64 bit, octa-core, 14 nmSamsung Exynos 8 Octa 8870, 2016, 64 bit, octa-core, 14 nm

Operative MemoryOperative Memory: 
RAM TypeType of volatile memory IC which specifies RAM architecture, timing characteristics, refresh mode, voltage levels and physical design of the IC. Two major types of random-access memory is static RAM (SRAM) periodically refreshed dynamic RAM (DRAM).  mobile (LP) DDR3 SDRAM
933 MHzClock frequency of the RAM databus (not necessarily equivalent to data transfer frequency). The width of the databus (e.g. 64 bit), RAM type (e.g. DDR SDRAM), number of channels and clock rate (e.g. 200 MHz) determines peak transfer rate
RAM CapacityCapacity of the random access memory in mebibytes (binary megabytes) 3072 MiB RAM

Non-volatile MemoryNon-volatile Memory: 
Non-volatile Memory TypeType of NV memory IC which determines storage technology, programming / erasing method and write endurance  Flash EEPROM
Non-volatile Memory InterfaceInterface (e.g. UFS 2.0, eMMC 5.1, moviNAND) which determines physical layer (width, clock rate, lanes, protocol) of data transfer between the application processor and the NV memory  Yes
Non-volatile Memory CapacityNon-volatile memory in mebibytes (binary megabytes).2GB = 1907.3MiB, 4GB = 3814.7MiB, 8GB = 7629.4MiB, 16GB = 15258.8MiB, 32GB = 30517.6MiB, 64GB = 61035.2MiB, 128GB = 122070.3MiB, 256GB = 244140.6MiB, 512GB = 488281.3MiB, 1TB = 953674MiB, 2TB = 1907349Mi 30518 MiB non-volatile

DisplayDisplayAll parameters that related to display
Display DiagonalThe distance measured between the furthest corners of the display. In case of display with rounded edges this refers to the diagonal of the smallest bounding rectangle. 139.7 mm
5.5 inchDisplay Diagonal in inches
ResolutionHorizontal and vertical resolution of the primary display. In case of display with rounded edges this refers to the smallest bounding rectangle. 1080x1920
2073600 pixelsThe total number of pixels is the product of horizontal and vertical number of pixels
Display WidthThe distance between the vertical edges of the display (horizontal display size). In case of display with rounded edges this refers to the smallest bounding rectangle. 68.49 mm
2.7 inchDisplay width in inches
Display HeightThe distance between the horizontal edges of the display (vertical Display Size). In case of display with rounded edges this refers to the smallest bounding rectangle. 121.76 mm
4.79 inchDisplay height in inches
Horizontal Full Bezel WidthDefined as the sum of width of left and right vertical display bezels. If the display panel is located in the middle width of left and right bezels are the same and their width is the half of the full bezel width. 5.71 mm
Display AreaCalculated display area is the product of max. horizontal and vertical display sizes. In case of display with rounded edges or notch this refers to the smallest display bounding rectangle. 8339.2 square millimeter
Display Area UtilizationRegular display area per regular front panel area ratio. This approximated indicator does not count with possible rounded corners (neither on front panel nor on display) or display notches, holes. 74.4%
Pixel SizeCalculated pixel size based on display diagonal, resolution and aspect ratio 0.06342 mm/pixel
Pixel DensityIndicates the number of pixels per inch 401 PPI
Display TypeDisplay technology, e.g. Color/ monochrome e-ink, STN, PM-OLED, AM-OLED, TN-TFT, IPS TFT, ASV TFT, MVA TFT, PVA TFT, PLS TFT  Color IPS TFT LCDColor IPS-TFT (In-Plane Switching - Thin Film Transistor) is also called Super TFT LCD. This is an active matrix LCD technology developed by Hitachi Ltd. in 1996. display
Display Color DepthColor depth defines how many colors or greyscales can be displayed 24 bit/pixel
Number of Display ScalesMaximal number of displayable colors or scales 16.8M
Display Dynamic Range DepthBit depth of the dynamic range defines the luminance ratio between the brightest and the darkest state of a pixel (HDR10: 10 bit, HDR10+: 12 bit) 8 bit/pixel
Display IlluminationForm of illumination used for lighting or backlighting LCD display in dark and dim ambient condtions.  Yes
Display Light Reflection ModeThe ratio between reflected and transmitted light depends on reflection mode thus display technology. Possible options: transflective, reflective, transmissive, etc.  Yes
Display Subpixel SchemeSpecifies how and how many subpixels are pixels consists of. Usual schemes: RGB, RGBG, RGBW, PenTile, Diamond Pixel  RGB Matrix (3 subpixels)Each pixel has 3 subpixel (Red, Greed, Blue) with the same size. The subpixel order is often R-G-B but B-G-R is also used.
Scratch Resistant ScreenUsual types: Gorilla Glass generations, DragonTrail/X, Sapphire Glass  Corning Gorilla Glass 4Introduced in 2014

Graphical SubsystemGraphical Subsystem: 
Graphical ControllerManufacturer and part number of the graphics controller IC or commercial name of the intellectual property (IP) if the graphics controller is the part of a chipset ARM Mali-T880MP4

Audio/Video InterfacesAudio/Video Interfaces: 
A/V OutAudio/Video outputs form a heterogeneous group of interfaces that allow the user to connect the device to various external analog/digital multimedia devices (monitors, projectors, HD TVs) and play multimedia content. For example: MHL, DisplayPort, HDMI, e  No

Audio SubsystemAudio Subsystem: 
Audio Channel(s)Number of independent channels supported by the audio subsystem of the device, e.g.: mono, stereo, 5.1, 7.1, etc.  stereo

Sound Recording: 
Microphone(s)Analog or digital sound receiver. Main applications: voice calls, active noise cancellation, voice command, voice/video recording, voice identification  Yes

Sound Playing: 
D/A Converter Nominal ResolutionThe resulution (R) of the digital/analog converter which converts a series of R-wide binary samples to the analog voltage signal of the built-in speaker or audio out 24 bit quantization
D/A Holding FrequencyThe maximum holding frequency of the digital/analog converter 192000 Hz
Loudspeaker(s):   stereo
Audio Output:   USB Type-C

Cellular PhoneCellular Phone: 
Supported Cellular BandsList of supported cellular networks with band names. For example GSM900 refers to the GSM system with the 890-915 MHz uplink and 935-960 downlink bands.  GSM 850MHz (B5)GSM850 phones support GSM 850 MHz (B5) band (downlink: 869.2 MHz - 894.2 MHz, uplink: 824.2 MHz - 849.2 MHz) , GSM 900MHz (B8)GSM900 phones support P-GSM (Primary GSM) 900 MHz (B8) band (downlink: 935.0 MHz - 960.0 MHz, uplink: 890.0 MHz - 915.0 MHz) and may support E-GSM (Extended GSM) 900 MHz band (downlink: 925.0 MHz - 960.0 MHz, uplink: 880.0 MHz- 915.0 MHz. , GSM 1800MHz (B3)GSM1800 phones support GSM / DCS / PCS 1800 MHz (B3) band (downlink: 1805.2 - 1879.8 MHz, uplink: 1710.2 - 1784.8 MHz). , GSM 1900MHz (PCS, B2)GSM1900 phones support PCS 1900 MHz (B2) band (downlink: 1930.2 - 1989.8 MHz, uplink: 1850.2 - 1909.8 MHz) , UMTS 2100MHz (Band I, IMT)UMTS2100 phones support UMTS 1900 / 2100MHz (IMT, also refferred as UMTS Band I) band (downlink: 2112.4 - 2167.6 MHz, uplink: 1922.4-1977.6 MHz) , UMTS 1900MHz (Band II, PCS)UMTS1900 phones support UMTS 1900MHz (PCS, also refferred as UMTS Band II) band (downlink: 1932.4 - 1987.6 MHz, uplink: 1852.4-1907.6 MHz) , UMTS 850MHz (Band V, CLR)UMTS850 phones support UMTS 850 MHz (CLR, also refferred as UMTS Band V) band (downlink: 871.4 - 891.6 MHz, uplink: 826.4 - 846.6 MHz) , UMTS 900MHz (Band VIII)UMTS900 phones support UMTS 900 MHz (UMTS Band VIII) band (downlink: 927.4 - 957.6 MHz, uplink: 882.4-912.6 MHz) , TD-SCDMA 2000 MHz (B34)TD-SCDMA2000 phones support TD-SCDMA 2000 MHz (B34) band (2010 - 2025 MHz) , TD-SCDMA 1900 MHz (B39)TD-SCDMA1900 phones support TD-SCDMA 1900 MHz (B39) band (1880 - 1920 MHz) , LTE 2100 MHz (Band 1)LTE2100 phones support LTE 1900 / 2100MHz (IMT, also refferred as LTE Band 1) band (downlink: 2110 - 2170 MHz, uplink: 1920 - 1980 MHz) , LTE 1800 MHz (Band 3)LTE1800 phones support LTE 1800 MHz (LTE Band 3) band (downlink: 1805 - 1880 MHz, uplink: 1710 - 1785 MHz) , LTE 2600 MHz (Band 7)LTE2600 phones support LTE 2600 MHz (LTE Band 7) band (downlink: 2620 - 2690 MHz, uplink: 2500 - 2570 MHz) , TD-LTE 2600 MHz (Band 38)TD-LTE 2600 MHz phones support TD-LTE 2600 MHz (LTE Band 38) band (2570 - 2620 MHz) , TD-LTE 1900 MHz (Band 39)TD-LTE 1900 MHz phones support Chinese TD-LTE 1900 MHz (LTE Band 39) band (1880 - 1920 MHz) , TD-LTE 2300 MHz (Band XL)TD-LTE 2300 phones support Chinese TD-LTE 2300 MHz (LTE Band 40) band (2300 - 2400 MHz) , TD-LTE 2500 MHz (Band XLI)TD-LTE 2500 MHz phones support TD-LTE 2500 MHz (LTE Band 41) band (2496 - 2690 MHz) bands
Supported Cellular Data LinksList of supported cellular data links and rates.  GPRS (Class unspecified)General Packet Radio Service , EDGE (Class unspecified)Enhanced Data Rates for GSM Evolution also known as Enhanced GPRS (EGPRS) , UMTS 384 kbps (W-CDMA)Universal Mobile Telecommunications System. UMTS Release '99 data link layer, W-CDMA grants up to 384 kbit/s pocket-switched download speed. , HSUPA (Cat. unspecified)High-Speed Uplink Packet Access is a 3.5G UMTS uplink protocol. , HSDPA (Cat. unspecified)High-Speed Downlink Packet Access is a 3.5G UMTS downlink protocol. , HSPA+ 21.1 Mbps (Cat. 18) , TD-SCDMATime Division Synchronous Code Division Multiple Access is the implementation of UMTS (3G) cellular network in China. , TD-HSDPA , LTE (Cat. unspecified)LTE (Long Term Evolution) or the E-UTRAN (Evolved Universal Terrestrial Access Network), introduced in 3GPP R8, is the 4G access part of the Evolved Packet System (EPS). , LTE 300 Mbps / 50 Mbps (Cat. 6)More exact values: LTE 301.5 Mbps / 50.4 Mbps (Cat. 6) data links
SIM Card SlotSupported Subscriber Identification Card (SIM) Format like mini-SIM, micro-SIM, nano-SIM, embedded SIM, etc.  Nano-SIM (4FF)
Cellular AntennaPhysical antenna layout. Most common type: internal. Historic types: fixed external, pull-out, open-out  Internal antenna
Call Alert SoundPolyphonic or monophonic call alert sound (number of chords) 64-chord melody
Complementary Phone ServicesPossible extras: voice transmission, voice speaker, vibration, speakerphone, active noise cancellation, PTT, HD Voice, VoLTE, etc.  Voice transmissionDevice is able to receive and transmit voice over cellular network , Voice speakerDedicated voice speaker is located near to the ear when talking and optimized for the spectrum and peak-to-peak range of the human voice. , Vibrating Alert , Speakerphone
Cellular ControllerManufacturer part number of the cellular modem and controller IC or commercial name of the intellectual property (IP) if the function is the part of a chipset Samsung Exynos 8870 ModAP

Secondary Cellular PhoneSecondary Cellular Phone: 
Dual Cellular Network OperationDetermines how the device can handle multiple cellular networks and SIM cards. For example dual-standy, dual-active  Dual standbyCellular modules of dual standby phones can simultaneous connect to the same (e.g. GSM/GSM, LTE/LTE) or different (e.g. CDMA/GSM) network. During call or data transmission on any cellular modules the other cellular module is automatically switched off
Sec. Supported Cellular Networks:   GSM 850MHz (B5)GSM850 phones support GSM 850 MHz (B5) band (downlink: 869.2 MHz - 894.2 MHz, uplink: 824.2 MHz - 849.2 MHz) , GSM 900MHz (B8)GSM900 phones support P-GSM (Primary GSM) 900 MHz (B8) band (downlink: 935.0 MHz - 960.0 MHz, uplink: 890.0 MHz - 915.0 MHz) and may support E-GSM (Extended GSM) 900 MHz band (downlink: 925.0 MHz - 960.0 MHz, uplink: 880.0 MHz- 915.0 MHz. , GSM 1800MHz (B3)GSM1800 phones support GSM / DCS / PCS 1800 MHz (B3) band (downlink: 1805.2 - 1879.8 MHz, uplink: 1710.2 - 1784.8 MHz). , GSM 1900MHz (PCS, B2)GSM1900 phones support PCS 1900 MHz (B2) band (downlink: 1930.2 - 1989.8 MHz, uplink: 1850.2 - 1909.8 MHz)
Sec. Supported Cellular Data Links:   GPRS (Class unspecified)General Packet Radio Service , EDGE (Class unspecified)Enhanced Data Rates for GSM Evolution also known as Enhanced GPRS (EGPRS)
Sec. SIM Card SlotSecondary Supported Subscriber Identification Card (SIM) Format  Yes
Internal antenna
Sec. Phone Controller IC:  Samsung Exynos 8870 ModAP

Control PeripheralsControl Peripherals: 
Touchscreen TypeDetermines how the touchscreen module senses the touch of the screen  Capacitive multi-touch sensing screen
Touchscreen Simultaneous Touch PointsDetermines how many touches the touch-sensitive screen module is able to simultaneously detect at most  Yes


Communication InterfacesCommunication Interfaces: 
Expansion InterfacesNon-volatile memory and/or I/O expansion interfaces. For example: microSD, microSDXC, SDHC, CF II., PCMCIA III., etc.  No
USBFirst or the only USB port. USB is a common high-speed serial bus standard that allows data and power transfer between the mobile device and another computer. Version of USB identifies USB standard.  USB 2.0Released in April 2000, USB 2.0 specification introduced USB Hi-Speed enabling devices to communicate at 480 Mbit/s data rate.
USB Hi-Speed (480 Mbps)Determines the highest available data transfer speed of first USB port. Usual standard speed levels: High-Speed (HS), Super-Speed (SS)
USB ServicesPossible services: USB power supply, USB charging, USB fast charging, USB host, OTG, etc.  USB chargingThe device is able to charge its battery supplied from the USB port. , USB HostUSB host devices are capable of controlling USB client devices, like mass storage devices, mouse, keyboard, camera, printer, scanner, etc. , USB On-The-Go 1.3 , USB Power DeliveryDevice which meets USB Battery Charging Specification Revision 1.1 / 1.2 is able to supply current from 500 mA to 1.5 A for the client device at 5V.
USB ConnectorPhysical USB connector layout. Most common types: micro-USB, USB A, USB Type-C or proprietary (e.g. Lightning)  USB Type-C reversible
BluetoothIEEE 802.15 is a short-range radio technology standard that allows transfer of data, and the use of accessories such as wireless audio devices and printers. This field specifies the supported BT version.  Bluetooth 4.1Bluetooth 4.1 is an evolutionary update to the Bluetooth Core Specification. It rolls up adopted Bluetooth Core Specification Addenda (CSA1, 2, 3 & 4) while adding new features and benefits. Bluetooth 4.1 improves usability for consumers, empowers inn
Internal antenna
Bluetooth profilesList of supported Bluetooth profiles e.g. aptX, A2DP, AVRCP, HSP, HID, PBA, PAN, OPP, MAP  A2DPAdvanced Audio Distribution Profile , AVRCPAudio/Video Remote Control Profile (AVRCP)
Wireless LANWireless LAN / WLAN / Wi-Fi: 802.11 defines a medium-range wireless data link that allows for internet access and data transfer. This field enumerates the supported protocols (e.g. 802.11a/b/g/n).  IEEE 802.11aShort range standard, 5 GHz, max. 54 Mbit/s , IEEE 802.11b2.4 GHz (ISM band), max. 11 Mbit/s , IEEE 802.11g2.4 GHz (ISM band), max. 54 Mbit/s , IEEE 802.11n2.4 GHz (ISM band) or optional 5 GHz support, max. 600 Mbit/s thanks to MIMO antennas
Internal antenna
Wireless ServicesPossible extras: Miracast, DLNA, WiFi Tethering, UPnP, WiFi Display, AirPlay, etc.  Wi-Fi Direct , Wi-Fi TetheringWi-Fi Mobile Hotsport

Multimedia BroadcastMultimedia Broadcast: 
FM Radio ReceiverWith a bulit-in FM radio the device is able to receive FM (frequency modulated) broadcast in 79 - 108 MHz band.  No

Satellite NavigationSatellite Navigation: 
Supported GPS protocol(s)Possible protocols: NMEA 0183, SIRF, etc.  GPS (NMEA 0183)NMEA 0183
Satellite Antenna:   Internal antenna
Complementary Satellite ServicesPossible extras: S-GPS, A-GPS, Geotagging, TMC, QuickGPS, QZSS, etc.  Simultaneous GPS (S-GPS) , Assisted GPS , Geotagging , QuickGPS
Supported GLONASS protocol(s)GLONASS is a global satellite navigation system operated by Russia.  L1OFGLONASS L1OF FDMA signal centered at 1602 MHz, features a BPSK(0.5) modulation.
Navigation ControllerManufacturer part number of the GNSS (GPS, GLONASS, Galileo and/or BDS) controller IC or commercial name of the intellectual property (IP) if the controller is the part of a chipset Samsung Exynos 8870

Primary Camera SystemPrimary Camera SystemPrimary camera usually has better imaging capabilities than secondary camera if any
Camera PlacementRefers to the placement of the primary camera on the device. Front, rear or rotatable. Generally rear.  Rear
Camera Image SensorRefers to the semiconductor technology of image sensor (FSI CMOS, BSI CMOS, etc.)  CMOSComplementary MOS circuit
Camera ResolutionA measurement of the maximum horizontal and vertical pixel numbers at which the camera can take a picture 4128x3096 pixel
Number of effective pixelsA measurement of the maximum pixel number at which the camera can take a picture, often referred to as Megapixels (when horizontal and vertical measurements are multiplied) 12.8 MP camera
ZoomA feature that changes the focal length of the lens of a camera. Optical zoom requires the lens to move in and out, providing high-quality close ups from a distance 1.0 x optical zoom
FocusCD AF, PD AF, Laser AF, etc. No / Not supported means there is no adjustable optical system or no camera built-in at all  Contrast Detection Autofocus (CD AF)Contrast-detection (CD) is a passive autofocus method without distance measurement which adjusts the optical system until maximum contrast is measured through the lens.
Recordable Image FormatsSupported file formats while capturing photos by primary camera  JPG
Video RecordingA measurement of the maximum horizontal and vertical pixel numbers at which the primary camera can capture video 1920x1080 pixel
30 fpsRecording frame rate when recording video at maximum resolution
Recordable Video FormatsSupported file formats while capturing videos  3GP , 3G2 , MPEG4
FlashA flash is used to brighten dark areas when taking photographs; is also used as a flashlight. This field contains the exact type of the flash.  dual LED
Camera Extra FunctionsPopular extra features of the primary camera: EIS, EIS for video, OIS, OIS for video, Face detection, 3D photo, HDR photo, HDR video, Macro mode, Panorama Photo, Red-eye reduction, Refocus, Smile detection, Slow motion video, Burst mode, Face Retouch  HDR photoHigh dynamic range image recording , Macro modeAn autofocus feature that allows for close-up photographs to be taken with the onboard digital camera

Auxiliary Camera: 
Aux. Camera Image SensorAuxiliary camera image sensor technology in at least dual lens setup  No

Auxiliary Camera No. 2: 
Aux. 2 Camera Image SensorAuxiliary 2 camera image sensor technology in at least triple lens setup  No

Auxiliary Camera No. 3: 
Aux. 3 Camera Image SensorAuxiliary 3 camera image sensor technology in at least quad lens setup  No

Auxiliary Camera No. 4: 
Aux. 4 Camera Image SensorAuxiliary 4 camera image sensor technology in at least penta lens setup  No
Aux. 4 Camera FocusFocusing method of the fourth auxiliary camera  No

Secondary Camera SystemSecondary Camera SystemWidely used for video telephony or taking selfies
Secondary Camera PlacementRefers to the placement of the secondary camera on the device. Front or rear. Generally front camera for selfies or video call.  Front
Secondary Camera SensorRefers to the semiconductor technology of sec camera image sensor (FSI CMOS, BSI CMOS, etc.)  CMOSComplementary MOS circuit
Secondary Camera ResolutionA measurement of the maximum horizontal and vertical pixel numbers at which the secondary camera can take a picture 2592x1944 pixel
Secondary Camera Number of pixelsA measurement of the maximum pixel number at which the sec. camera can take a picture, often referred to as Megapixels (when horizontal and vertical measurements are multiplied) 5.0 MP sec. cam
Secondary Recordable Image FormatsSupported file formats while capturing photos by secondary camera  JPG
Secondary Video RecordingA measurement of the maximum horizontal and vertical pixel numbers at which the secondary camera can capture video 1920x1080 pixel
30 fpsRecording frame rate when recording video by the secondary camera at maximum resolution
Secondary Recordable Video FormatsSupported file formats while capturing videos by the secondary camera  3GP

Secondary Auxiliary Camera: 
Sec. Aux. Cam. Image SensorImage sensor technology of sec. auxiliary camera in at least dual lens secondary camera setup  No

Secondary Auxiliary Camera No. 2: 
Sec. Aux. 2 Cam. Image SensorImage sensor technology of sec. auxiliary 2 camera in at least triple lens secondary camera setup  No

Built-in SensorsBuilt-in Sensors: 
Built-in compassBuilt-in electroinc compass types: 1D, 2D, 3D  Yes
Built-in accelerometerAn internal component that senses acceleration components of the device. Used for automatic screen rotation and for games and applications that rely on acceleration measurement on X, Y, and Z axis. Possible types: 1D, 2D, 3D  Yes
Built-in gyroscopeAn internal component that senses the orientation of the device. Used for automatic screen rotation and for games and applications that rely on the devices position in the X, Y, and Z axis. Possible types: 1D, 2D, 3D  Yes
Additional sensorsBuilt-in ambient (barometer, temperature, altimeter, light, etc.), biometric (fingerprint, HR, step, etc.) and comfort (hall sensor, gesture sensor, proximity, etc.) sensors  Fingerprint sensorDevice is able to identify the user by using a built-in dedicated biometric fingerprint recogniser sensor placed at the front, rear or any side of the device , Hall sensor , Light intensity sensorBy measuring the intensity of the ambient light device may control the brightness level of the screen

Ingress ProtectionIngress Protection: 
Protection from solid materialsIngress Protection Standards. IP First digit: Protection from solid objects or materials  Yes
Protection from liquidsIngress Protection Standards. IP Second digit: Protection from liquids  Yes

Power SupplyPower Supply: 
BatteryBattery technology  Lithium-ion polymer (LiPo)
built-inPossible options: removable, built-in
1-cellIn case of high power consumption it is more efficient to connect more than 1 cells in the battery in series to minimize current thus loss.
Nominal Cell Capacity (1st cell)The nominal mAh capacity of the first battery cell 3000 mAh cell
Nominal Battery CapacityIf there are more than 1 cells in the battery in parellel connection the nominal resulting battery capacity is the sum of capacity of cells 3000 mAh battery

Geographical AttributesGeographical Attributes: 
Market RegionsRegions where the device was officially sold. Overlap is possible.  Southeast Asia

Datasheet AttributesDatasheet Attributes: 
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Preliminary
AddedThe exact time of the datasheet addition 2016-06-28 23:05
 

LeEco X502 LTE Dual SIM Detailed Tech Specs

LeEco X502 LTE Dual SIM Detailed Tech Specs
Platform: android Supported Cellular Bands: gsm Supported Cellular Data Links: gprs Supported Cellular Data Links: edge Supported Cellular Data Links: umts Supported Cellular Data Links: tdscdma Supported Cellular Data Links: hspa Supported Cellular Data Links: hspa_plus Supported Cellular Data Links: lte Supported Cellular Data Links: lte-a Complementary Phone Services: phone Complementary Phone Services: vibration Complementary Phone Services: speakerphone Dual Cellular Network Operation USB Services: usb_otg USB Connector: usb_c Bluetooth Wireless LAN Supported GPS protocol(s) Supported GLONASS protocol(s) Number of effective pixels: 12.8 MP camera Aux. Camera Number of Pixels : 0.0 MP aux. cam Secondary Camera Number of pixels: 5.0 MP sec. cam Built-in compass Built-in accelerometer Built-in gyroscope Additional sensors: fingerprint

See also

LeEco Coolpad Changer Cool S1 Premium Edition Dual SIM TD-LTE 64GB C105-6
LeEco Coolpad Changer Cool S1 Premium Edition Dual SIM TD-LTE 64GB C105-6
74.7x151.4x7.5 mm, Google Android 6.0.1 (Marshmallow), Qualcomm Snapdragon 821 MSM8996AC Pro, 6 GiB RAM, 64 GB ROM, 5.5 inch, 1080x1920, 16.3 MP camera, 8.0 MP sec. cam, 4070 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

LeEco Coolpad Changer Cool S1 Standard Edition Dual SIM TD-LTE 64GB C105-6
LeEco Coolpad Changer Cool S1 Standard Edition Dual SIM TD-LTE 64GB C105-6
74.7x151.4x7.5 mm, Google Android 6.0.1 (Marshmallow), Qualcomm Snapdragon 821 MSM8996AC Pro, 4 GiB RAM, 64 GB ROM, 5.5 inch, 1080x1920, 16.3 MP camera, 8.0 MP sec. cam, 4070 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

LeEco Le Pro 3 AI Edition Dual SIM TD-LTE CN 64GB
LeEco Le Pro 3 AI Edition Dual SIM TD-LTE CN 64GB
75.1x152.4x7.5 mm, Google Android 6.0.1 (Marshmallow), MediaTek Helio X27 MT6797X, 4 GiB RAM, 64 GB ROM, 5.5 inch, 1080x1920, 13.0 MP camera, 8.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

LeEco X656 Le Pro 3 AI Edition Dual SIM TD-LTE CN 32GB / X658 / X659
LeEco X656 Le Pro 3 AI Edition Dual SIM TD-LTE CN 32GB / X658 / X659
75.1x152.4x7.5 mm, Google Android 6.0.1 (Marshmallow), MediaTek Helio X23 MT6797D, 4 GiB RAM, 32 GB ROM, 5.5 inch, 1080x1920, 13.0 MP camera, 8.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

LeEco X850 Le Max 3 Dual SIM TD-LTE CN 64GB
LeEco X850 Le Max 3 Dual SIM TD-LTE CN 64GB
78x157.2x8 mm, Google Android 6.0.1 (Marshmallow), Qualcomm Snapdragon 821 MSM8996AC Pro, 4 GiB RAM, 64 GB ROM, 5.7 inch, 1440x2560, 13.0 MP camera, 15.9 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

LeEco Le Pro3 Elite Edition Dual SIM TD-LTE CN
LeEco Le Pro3 Elite Edition Dual SIM TD-LTE CN
83.9x151.4x7.5 mm, Google Android 6.0.1 (Marshmallow), Qualcomm Snapdragon 820 MSM8996, 4 GiB RAM, 32 GB ROM, 5.5 inch, 1080x1920, 15.9 MP camera, 8.0 MP sec. cam, 4070 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

LeEco X920 LeMax 2 Pro Dual SIM TD-LTE
LeEco X920 LeMax 2 Pro Dual SIM TD-LTE
82x165x8.5 mm, Google Android 6.0.1 (Marshmallow), Qualcomm Snapdragon 821 MSM8996AC Pro, 6 GiB RAM, 128 GB ROM, 6.3 inch, 1440x2560, 22.5 MP camera, 8.0 MP sec. cam | All detailsAll details | Add this item to the comparisonAdd to compare

LeEco X726 Le Pro3 Dual SIM TD-LTE CN 64GB
LeEco X726 Le Pro3 Dual SIM TD-LTE CN 64GB
83.9x151.4x7.5 mm, Google Android 6.0.1 (Marshmallow), Qualcomm Snapdragon 821 MSM8996AC Pro, 4 GiB RAM, 64 GB ROM, 5.5 inch, 1080x1920, 15.9 MP camera, 8.0 MP sec. cam, 4070 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

LeEco X726 Le Pro3 Dual SIM TD-LTE CN 32GB
LeEco X726 Le Pro3 Dual SIM TD-LTE CN 32GB
83.9x151.4x7.5 mm, Google Android 6.0.1 (Marshmallow), Qualcomm Snapdragon 821 MSM8996AC Pro, 4 GiB RAM, 32 GB ROM, 5.5 inch, 1080x1920, 15.9 MP camera, 8.0 MP sec. cam, 4070 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

LeEco Le Pro3 TD-LTE AM
LeEco Le Pro3 TD-LTE AM
83.9x151.4x7.5 mm, Google Android 6.0.1 (Marshmallow), Qualcomm Snapdragon 821 MSM8996AC Pro, 4 GiB RAM, 64 GB ROM, 5.5 inch, 1080x1920, 15.9 MP camera, 8.0 MP sec. cam, 4070 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

LeEco X652 Le3 TD-LTE Dual SIM 32GB / LEX652
LeEco X652 Le3 TD-LTE Dual SIM 32GB / LEX652
75.1x152.4x7.5 mm, Google Android 6.0.1 (Marshmallow), MediaTek Helio X25 MT6797, 3 GiB RAM, 32 GB ROM, 5.5 inch, 1080x1920, 13.0 MP camera, 8.0 MP sec. cam, 3900 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

LeEco X522 Le S3 Dual SIM LTE AM / Le 2
LeEco X522 Le S3 Dual SIM LTE AM / Le 2
74.2x151.1x7.5 mm, Google Android 6.0.1 (Marshmallow), Qualcomm Snapdragon 620 MSM8976 / Snapdragon 652, 3 GiB RAM, 32 GB ROM, 5.5 inch, 1080x1920, 15.9 MP camera, 8.0 MP sec. cam, 3000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

LeTV X508 Le 1s Dual SIM TD-LTE 32GB
LeTV X508 Le 1s Dual SIM TD-LTE 32GB
74.2x151.1x7.5 mm, Google Android 5.1.1 (Lollipop), MediaTek Helio X10 MT6795T, 3 GiB RAM, 32 GB ROM, 5.5 inch, 1080x1920, 13.0 MP camera, 5.0 MP sec. cam, 3000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

LeTV X608 Le1 Dual SIM TD-LTE 16GB
LeTV X608 Le1 Dual SIM TD-LTE 16GB
74.2x147.8x9.5 mm, Google Android 5.0.2 (Lollipop), MediaTek Helio X10 MT6795, 3 GiB RAM, 16 GB ROM, 5.5 inch, 1080x1920, 13.0 MP camera, 5.0 MP sec. cam, 3000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

LeEco X900+ LeMax Dual SIM TD-LTE 64GB
LeEco X900+ LeMax Dual SIM TD-LTE 64GB
83.5x167.1x8.95 mm, Google Android 5.0.2 (Lollipop), Qualcomm Snapdragon 810 MSM8994 v2.1, 4 GiB RAM, 64 GB ROM, 6.3 inch, 1440x2560, 21.5 MP camera, 4.1 MP sec. cam, 3400 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

LeEco X720 Le Pro3 Special Edition Dual SIM TD-LTE 64GB
LeEco X720 Le Pro3 Special Edition Dual SIM TD-LTE 64GB
83.9x151.4x7.5 mm, Google Android 6.0.1 (Marshmallow), Qualcomm Snapdragon 821 MSM8996AC Pro, 4 GiB RAM, 64 GB ROM, 5.5 inch, 1080x1920, 15.9 MP camera, 8.0 MP sec. cam, 4070 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

LeEco X720 Le Pro3 Special Edition Dual SIM TD-LTE 128GB
LeEco X720 Le Pro3 Special Edition Dual SIM TD-LTE 128GB
83.9x151.4x7.5 mm, Google Android 6.0.1 (Marshmallow), Qualcomm Snapdragon 821 MSM8996AC Pro, 6 GiB RAM, 128 GB ROM, 5.5 inch, 1080x1920, 15.9 MP camera, 8.0 MP sec. cam, 4070 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

LeEco X720 Le Pro3 Standard Edition Dual SIM TD-LTE 32GB
LeEco X720 Le Pro3 Standard Edition Dual SIM TD-LTE 32GB
83.9x151.4x7.5 mm, Google Android 6.0.1 (Marshmallow), Qualcomm Snapdragon 821 MSM8996AC Pro, 4 GiB RAM, 32 GB ROM, 5.5 inch, 1080x1920, 15.9 MP camera, 8.0 MP sec. cam, 4070 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

LeEco X720 Le Pro3 Standard Edition Dual SIM TD-LTE 64GB / LEX720 Le 3 Pro
LeEco X720 Le Pro3 Standard Edition Dual SIM TD-LTE 64GB / LEX720 Le 3 Pro
83.9x151.4x7.5 mm, Google Android 6.0.1 (Marshmallow), Qualcomm Snapdragon 821 MSM8996AC Pro, 6 GiB RAM, 64 GB ROM, 5.5 inch, 1080x1920, 15.9 MP camera, 8.0 MP sec. cam, 4070 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

LeEco X820 Le Max 2 Dual SIM TD-LTE 32GB / X821 / X822
LeEco X820 Le Max 2 Dual SIM TD-LTE 32GB / X821 / X822
77.6x156.8x7.99 mm, Google Android 6.0.1 (Marshmallow), Qualcomm Snapdragon 820 MSM8996, 4 GiB RAM, 32 GB ROM, 5.7 inch, 1440x2560, 21.2 MP camera, 8.0 MP sec. cam, 3100 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

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