Generel Characteristics:
|
Designer![Company which designed the semiconductor component Company which designed the semiconductor component](icons/10x10/info_gray.gif) |
Qualcomm |
Type: |
Snapdragon 415 MSM8929 |
Year Released: |
2015 |
Function |
Multi-core Application Processor with Modem |
Architecture:
|
Width of Machine Word![Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors.](icons/10x10/info_gray.gif) |
64 bit |
Supported Instruction Set(s): |
ARMv8 (A32, A64) |
Type of processor core(s)![Type and allocation of processor core(s) Type and allocation of processor core(s)](icons/10x10/info_gray.gif) |
8x ARM Cortex-A53 MPcore |
Number of processor core(s): |
octa-core |
Buses:
|
Memory Interface(s): |
LPDDR3 SDRAM |
Data Bus Width![Maximum selectable bit width of primary data bus (RAM) of memory interface Maximum selectable bit width of primary data bus (RAM) of memory interface](icons/10x10/info_gray.gif) |
32 bit |
Number of data bus channels: |
1 ch |
Non-volatile Memory Interface |
eMMC 4.5 |
Clock Frequencies:
|
Recommended Maximum Clock Frequency: |
1600 MHz max. |
Cache Memories:
|
Technology and Packaging:
|
Feature Size![The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology](icons/10x10/info_gray.gif) |
28 nm |
Semiconductor Technology: |
CMOS![Complementary Metal-oxide - Semiconductor Field Effect Transistor Complementary Metal-oxide - Semiconductor Field Effect Transistor](icons/10x10/info_gray.gif) |
Fab![Plant which fabricates the semiconductor component Plant which fabricates the semiconductor component](icons/10x10/info_gray.gif) |
TSMC |
Graphical Subsystem:
|
Embedded GPU![Manufactuer (or IP designer) and type of embedded graphics coprocessor(s). Manufactuer (or IP designer) and type of embedded graphics coprocessor(s).](icons/10x10/info_gray.gif) |
Qualcomm Adreno 306 GPU |
Dedicated Graphics Memory![Dedicated operative memory (video RAM, VRAM) Dedicated operative memory (video RAM, VRAM)](icons/10x10/info_gray.gif) |
0.25 MiB |
Cellular Communication:
|
Supported Cellular Data Links |
CSD
, GPRS
, EDGE
, UMTS
, HSUPA
, HSDPA
, HSPA+ 42.2
, DC-HSDPA 42.2
, cdmaOne
, CDMA2000 1x
, CDMA2000 1xEV-DO
, CDMA2000 1xEV-DO Rev A
, CDMA2000 1xEV-DO Rev B
, TD-SCDMA
, LTE
, LTE 100/50
, LTE 150/50 data links |
Additional Information:
|
Special Features: octa 64-bit ARM Cortex-A53 MPcore Harvard Superscalar core, eMMC 4.51 interface, Hexagon V50 DSP, CDMA 2000 1x Adv./DO Rel 0., Rev. A/B, SVDO-DB, GSM, GPRS, EDGE, UMTS, HSPA+ 42 Mbps, HSUPA, LTE FDD/TDD Cat. 4, SVLTE-DB, Rel9 DC-HSPA+, TD-SCDMA baseband.. ›› |
Datasheet Attributes:
|
Data Integrity |
Preliminary |
Added![The exact time of the datasheet addition The exact time of the datasheet addition](icons/10x10/info_gray.gif) |
2015-06-22 11:25 |