Generel Characteristics:
|
Designer![Company which designed the semiconductor component Company which designed the semiconductor component](icons/10x10/info_gray.gif) |
Qualcomm |
Type: |
Snapdragon 8 Gen 2 for Galaxy SM8550-AC |
Codename: |
Kalama |
Year Released: |
2022 |
Function |
Multi-core Application Processor with Modem |
Architecture:
|
Width of Machine Word![Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors.](icons/10x10/info_gray.gif) |
64 bit |
Supported Instruction Set(s): |
ARMv9-A (A32, A64) |
Number of processor core(s): |
8 |
Type of processor core(s)![Type and allocation of processor core(s) Type and allocation of processor core(s)](icons/10x10/info_gray.gif) |
1x ARM Cortex-X3 + 2x ARM Cortex-A715 + 2x ARM Cortex-A710 + 3x ARM Cortex-A510 |
Buses:
|
Memory Interface(s): |
LPDDR5 SDRAM
, LPDDR5X SDRAM |
Max. Clock Frequency of Memory IF![Clock frequency of fastest supported memory interface Clock frequency of fastest supported memory interface](icons/10x10/info_gray.gif) |
4266 MHz |
Data Bus Width![Maximum selectable bit width of primary data bus (RAM) of memory interface Maximum selectable bit width of primary data bus (RAM) of memory interface](icons/10x10/info_gray.gif) |
16 bit |
Number of data bus channels: |
4 ch |
Max. Data Rate![Maximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. Maximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units.](icons/10x10/info_gray.gif) |
68.26 Gbyte/s |
Non-volatile Memory Interface |
UFS 3.1
, UFS 3.1 2-lane
, UFS 4.0![UFS 4.0 (released in May, 2022) defines 4.2 GB/s V-NAND interface UFS 4.0 (released in May, 2022) defines 4.2 GB/s V-NAND interface](icons/10x10/info_gray.gif) |
Clock Frequencies:
|
Recommended Maximum Clock Frequency: |
3360 MHz max. |
Cache Memories:
|
Total L3 Cache: |
8192 Kbyte L3 |
Technology and Packaging:
|
Feature Size![The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology](icons/10x10/info_gray.gif) |
4 nm |
Semiconductor Technology: |
CMOS![Complementary Metal-oxide - Semiconductor Field Effect Transistor Complementary Metal-oxide - Semiconductor Field Effect Transistor](icons/10x10/info_gray.gif) |
Fab![Plant which fabricates the semiconductor component Plant which fabricates the semiconductor component](icons/10x10/info_gray.gif) |
Samsung |
Graphical Subsystem:
|
Embedded GPU![Manufactuer (or IP designer) and type of embedded graphics coprocessor(s). Manufactuer (or IP designer) and type of embedded graphics coprocessor(s).](icons/10x10/info_gray.gif) |
Qualcomm Adreno 740 GPU |
GPU Clock: |
719 MHz GPU |
Cellular Communication:
|
Supported Cellular Data Links |
CSD 9.6 kbps
, GPRS (Class unspecified)
, GPRS Class 12
, GPRS Multi-slot Class 12
, GPRS Multi-slot Class 32
, GPRS Multi-slot Class 33
, EDGE (Class unspecified)
, EDGE Multi-slot Class 10
, EDGE Multi-slot Class 12
, EDGE Multi-slot Class 32
, EDGE Multi-slot Class 33
, UMTS 384 kbps (W-CDMA)
, HSUPA (Cat. unspecified)
, HSUPA 1.46 Mbps (Cat. 2)
, HSUPA 2.0 Mbps (Cat. 5)
, HSUPA 5.76 Mbps (Cat. 6)
, HSUPA 11.5 Mbps (Cat. 7)
, HSDPA (Cat. unspecified)
, HSDPA 1.8 Mbps (Cat. 4)
, HSDPA 3.6 Mbps (Cat. 6)
, HSDPA 7.2 Mbps (Cat. 8)
, HSDPA 10.2 Mbps (Cat. 9)
, HSDPA 14.4 Mbps (Cat. 10)
, HSPA+ 21.1 Mbps (Cat. 18)
, HSPA+ 28.8 Mbps (Cat. 16)
, HSPA+ 42.2 Mbps (Cat. 20)
, DC-HSDPA 42.2 Mbps (Cat. 24)
, cdmaOne (IS-95)
, CDMA2000 1xRTT (IS-2000)
, CDMA2000 1xEV-DO Rel. 0
, CDMA2000 1xEV-DO Revision A
, CDMA2000 1xEV-DO Revision B
, TD-SCDMA
, TD-HSDPA
, LTE (Cat. unspecified)
, LTE 50 Mbps / 25 Mbps (Cat. 2)
, LTE 75 Mbps / 25 Mbps (Cat. 3)
, LTE 100 Mbps / 50 Mbps (Cat. 3)
, LTE 150 Mbps / 50 Mbps (Cat. 4)
, LTE 225 Mbps / 50 Mbps
, LTE 300 Mbps / 50 Mbps (Cat. 6)
, LTE 300 Mbps / 75 Mbps (Cat. 5)
, LTE 300 Mbps / 100 Mbps (Cat. 7)
, LTE 400 Mbps / 150 Mbps (LTE Cat. 13)
, LTE 450 Mbps / 50 Mbps (LTE Cat. 9)
, LTE 450 Mbps / 100 Mbps (LTE Cat. 10)
, LTE 600 Mbps / 100 Mbps (LTE Cat. 12)
, LTE 1 Gbps / 100 Mbps (LTE Cat. 16)
, LTE 1.2 Gbps / 200 Mbps (LTE Cat. 18)
, LTE 1.6 Gbps (LTE Cat. 19)
, LTE 2.4 Gbps / 400 Mbps (Cat. 22)
, LTE 3 Gbps / 600 Mbps (LTE Cat. 24)
, NR 1.5 Gbps
, NR 2.6 Gbps
, NR 3.7 Gbps
, NR 4.6 Gbps
, NR 7.5 Gbps
, NR 10 Gbps data links |
Communication Interfaces:
|
Supported USB Specification: |
USB 2.0
, USB 3.0 / USB 3.1 Gen 1 / USB 3.2 Gen 1x1![Released in November 2008, USB 3.0 specification introduced USB SuperSpeed enabling devices to communicate at 5 Gbit/s. Later renamed as USB 3.1 Gen 1, then USB 3.2 Gen 1x1 Released in November 2008, USB 3.0 specification introduced USB SuperSpeed enabling devices to communicate at 5 Gbit/s. Later renamed as USB 3.1 Gen 1, then USB 3.2 Gen 1x1](icons/10x10/info_gray.gif) |
Bluetooth support |
Bluetooth 5.3![Released in July, 2021 Released in July, 2021](icons/10x10/info_gray.gif) |
Wireless LAN support |
IEEE 802.11a
, IEEE 802.11b
, IEEE 802.11g
, IEEE 802.11n
, IEEE 802.11ac
, IEEE 802.11ax (Wi-Fi 6)
, IEEE 802.11be (Wi-Fi 7)![Also known as WiFi 7. Supported carrier frequencies: 2.4 GHz, 5 GHz, 6 GHz Also known as WiFi 7. Supported carrier frequencies: 2.4 GHz, 5 GHz, 6 GHz](icons/10x10/info_gray.gif) |
NFC support |
Yes |
Supported Audio/Video Interface: |
HDMI (Unspecified)
, HDMI 1.4
, HDMI 1.4a
, HDMI 1.4b
, HDMI 2.0 (UHD)![HDMI 2.0 specification was published on September 4, 2013 with increased clock speed up to 600 MHz and resolution up to 4096x2160 at 60fps. HDMI 2.0 specification was published on September 4, 2013 with increased clock speed up to 600 MHz and resolution up to 4096x2160 at 60fps.](icons/10x10/info_gray.gif) |
Satellite Navigation:
|
Supported GPS protocol(s): |
Yes |
Supported Galileo service(s) |
Yes |
Supported GLONASS protocol(s) |
Yes |
Supported BeiDou system (BDS) |
Yes |
Additional Information:
|
Special Features: single Qualcomm Kryo Prime (1x ARM Cortex-X3 up to 3360 MHz, 1 Mbyte L2 cache) + dual Qualcomm Kryo Gold (2x ARM Cortex-A715 up to 2800 MHz, 512 Kbyte L2 cache per core) + dual Qualcomm Kryo Gold (2x ARM Cortex-A710 up to 2800 MHz, 512 Kbyte L2 cache per core) + triple Qualcomm Kryo Silver (4x ARM Cortex-A510R1 up to 2016 MHz) Harvard Superscalar cores, HMP, big.LITTLE, up to 16 GiB of RAM, 4 GiB system cache, Hexagon DSP, Qualcomm X70 5G NR Modem, CDMA 2000 1x Adv./DO Rel 0., Rev. A/B, SVDO-DB, GSM, GPRS, EDGE, UMTS, DB-DC-HSPA+, DC-HSUPA, LTE FDD/TDD, SVLTE-DB, Rel9 DC-HSPA+, TD-SCDMA, LTE Cat. 24 / Cat 22 (up to 2.5 Gbps / 300 Mbps), sub6 / mmWave 5G NR (10 Gbps / 3.5 Gbps) baseband modem, LTE dual SIM / dual active standby / dual VoLTE support (DSDV), 60 Hz 4K / 144 Hz QHD+ display support, 2160p HDR10+ 60 fps video decode, 8K 30 fps / 2160p 120 fps video encode, OpenCL 2.0, OpenGL ES 3.2, DirectX 12, Vulkan 1.3, 18-bit triple Qualcomm Image Signal Processors, 200 MP camera support, 64 MP + 36 MP dual lens camera support, EIS 3.0, Qualcomm Quick Charge 5 |
Datasheet Attributes:
|
Data Integrity |
Preliminary |
Added![The exact time of the datasheet addition The exact time of the datasheet addition](icons/10x10/info_gray.gif) |
2023-03-25 20:45 |